Adhesion Promoters
Adhesion promoters are used to enhance the bonding of photoresist to a silicon dioxide surface. Shin-Etsu MicroSi’s MicroPrime™ line of adhesion promoters readily react with the substrate material removing absorbed water and reducing surface energy. The resulting water repellent hydrophobic interface prevents etchants from undercutting the photoresist.
Shin-Etsu MicroSi has developed three MicroPrime™ product lines for the semiconductor industry. These products are based upon hexamethyldisilazane (HMDS); N,N-diethylaminotrimethylsilane (DEATS) and propylene glycol monomethyl-ether acetate (PGMEA) chemistry.
Specialty Adhesion Promoters
To enhance the effectiveness of thickfilm photoresist to copper and gold surfaces Shin-Etsu MicroSi offers two specialty adhesion promoters.
Selection Guide
| Adhesion Promoter |
Product Composition |
Application |
| MicroPrime HP Primer |
100% (HMDS) |
Highly purified grade of hexamethyldisilazane (HMDS) manufactured specifically for semiconductor applications |
| MicroPrime MP-90 |
>99.0% HMDS
<1.0% DEATS |
HMDS modified specifically for vapor track priming in the highly automated semiconductor lithography process. These products provide an increased contact angle that can improve adhesion characteristics on difficult substrates. An increase in the reaction mechanism provides a shorter prime dwell cycle, thereby improving throughput. |
| MicroPrime MP-95 |
>99.5% HMDS
<0.5% DEATS |
| MicroPrime MP-P20 |
20% HMDS 80% PGMEA |
HMDS modified specifically for spin on semiconductor lithography process. |
| Metal Adhesion Promoters |
Proprietary |
Copper Surfaces |