Chemically Amplified I-line application
Shin-Etsu MicroSi’s offers thick and thin Chemically Amplified positive I-line SIPR resist for specialty application. These resist are formulated for high thermal and high chemical stabilities.
SIPR 7120/7121
Shin-Etsu MicroSi’s SIPR 7120/7121 resist is formulated for high resolution, single coat, straight side wall profiles with printing capability of less 3 um trenches and isolated contact hole/stud in 3-100 um thick film photoresist. This resist is widely used in MEMS, bumps, thin film head and other specialty applications that require superior thermal/chemical stability with excellent photo speed capability for extremely aggressive plating and dry etching environment. It can be developed using TMAH or KOH developer.