ShinEtsu MicroSi, Inc.

Home
Products
Media Center
- Calendar of Events/Tradeshows
- Press Releases
About Us
Contact Us
- Information Request
FAQs
Site Map

D2D

Leadership in research, development and manufacture of materials for the semiconductor industry.

		Mr.Ms.		First Name:				Last Name:
Company:				Title:				Email:
Address:				City:				State:
ZIP:				Country:				Phone:

Comments / Application

Areas of Interest

Packaging

Thermal Grease
Thermal Gel
Pads & Phases Change Material
Molding Compounds
Encapsulents & Underfills
LED Encapsulent Material
Photo-imageable Dielectric Materials for Packaging and Bonding

Lithography

Photolithography Chemicals
Deep UV Photoresists
I-line; G-line Broadband DNQ resists1`
Contrast Chemicals
Barrier Coats
Adhesion Promoters
HMDS and HMDS Blends
Gold and Copper Applications

Photomask Products

Mask Blanks
Pellicles

Pirolytic Boron Nitride

Ceramic Products
PBN/PG Heaters

Substrates and Wafers

Quartz Substrates & Wafers
Lithium Tantalate Wafers

Vinyl Resins

Resin Technology
Optical Coatings

Thermal Interface Material

Application

Personal: (Less than 50 applications)
Commercial: (More than 50 applications)
Resale/Third Party Procurement
Educational/Research

Platform

ServerDesktopMobile
Do-it-yourselfOther

Thermal Interface Material

G751G765X23-7762
X23-7783DX23-7772-4Other

Please send me periodic updates in the areas indicated.

Copyright © , ShinEtsu MicroSi, Inc.