ShinEtsu MicroSi, Inc.

D2D

Leadership in research, development and manufacture of materials for the semiconductor industry.

Packaging 
 

Inter-Connectors


Shin-Etsu Inter-connectors are widely used for solder-less mounting of LGA Semiconductor devices. Shin-Etsu connectors utilize a newly developed low resistance elastomer, incorporating either silver or gold particles. Custom design of both contact spacing and pin height provide variations that ensure a good "Fit" for most applications. These are ideal inter-connectors for larger LGA devices where soldering is impractical.



Features


Shin-Etsu inter-connectors consist of conductive elastomer formed on top of a film or plastic substrate. Design flexibility assures a low compression load connection for high I/O count devices.



Shin-Etsu’s silver based connectors provide low resistance with a low inductance inter-connection; the silver conductive elastomer ensures stable high frequency inter-connection. Gold based connectors are well suited for test applications where multiple insertions are required.



Basic Properties


 

Basic Properties

Height

1.0 mm

2.0 mm

Pitch

As low as 0.8mm

Contact Resistance

<30m Ohm/pin

<50m Ohm/pin

Contact Resistance

<0.4nH/pin

<1nH/pin

Current Carrying Capacity

Max 4A/pin

Compression Force

0.25-0.6n/pin

Durability

<20 times



General Structure




High Pin (Low Stress) Design




Coaxial Design




Compression Load Vs. Deflection Amount (Standard Product)





Thermal Grease
Thermal Gel
Pads & Phase Change Material
Molding Compounds
Encapsulents & Underfills
LED Encapsulent Material
Photo-imageable Dielectric Materials
Interposers
Inter-Connectors

480.893.8898


10028 S. 51st Street,
Phoenix, AZ 85044