ShinEtsu MicroSi, Inc.

 

PACKAGING

The Shin-Etsu Group, utilizing the resources from multiple divisions offers an extensive product line for packaging and assembly applications. Shin-Etsu MicroSi is the leader in Thermal Management Material, has developed an extensive line of Molding Compounds, Encapsulents, Silicon and Epoxy coatings along with die Attachment Material and Connectors.

Semiconductor Packaging Products

• Thermal Grease
• Thermal Gel
• Pads & Phase Change Material
  • High Hardness Thermal Interface Silicone Rubber Pad Materials
  • Low Hardness Thermal Interface Silicone Rubber Pad Materials
  • Phase Change Material (PCM)
  • Double-sided tape
  • Electrically Conductive
• Molding Compounds
• Encapsulents & Underfills
• LED Encapsulent Material
• Photo-imageable dielectric materials for packaging and bonding
• Interposers
• Inter-Connectors