Photodefinable Materials for Advanced Packaging

Shin-Etsu manufactures a broad range of products for advanced packaging applications, wafer-level packaging, and 3D integration. These include photosensitive dielectric materials for redistribution wiring (RDL) and stress buffer applications, TSV filling, and permanent wafer bonding. Also, dielectric materials for D2D (die-to-die) and D2W (die-to-wafer) bonding, as well as wafer-level overmolding, temporary bonding materials that enable wafer thinning, and photoresists for copper pillar plating and other micro-interconnects. Many of these products are available as both spin-on as well as dry film materials. Shin-Etsu leads the industry in semiconductor-quality dry film manufacturing.

Shin-Etsu has a significant research program dedicated to developing materials for the next generation of interconnect technologies. It is not possible to list the range of current activities, but we welcome your inquiries on specific topics.