Thick Copper Pillar Bump Fabrication article published in Advanced Packaging Nov 2007

Shin-Etsu MicroSi Announced their standard TIM II Thermal Interface Material Meets RoHS environmental requirements.

Shin-Etsu MicroSi, Inc. is pleased to announce that our standard TIM II thermal interface materials meet the requirements of the European Union�s Restriction of Hazardous Substances in Electrical and Electronic Equipment, RoHS Directive 2002/95/EC.

Shin-Etsu MicroSi Announces New Line of Adhesiveless Flexible Copper Laminates

The "KN Series" products are a single sided copper construction while the "KV Series" is a double sided copper construction.