ShinEtsu MicroSi, Inc.

Packaging

• Thermal Grease
• Thermal Gel
• Pads & Phase Change Material
  • High Hardness Thermal Interface Silicone Rubber Pad Materials
  • Low Hardness Thermal Interface Silicone Rubber Pad Materials
  • Phase Change Material (PCM)
  • Double-sided tape
  • Electrically Conductive
• Molding Compounds
• Encapsulents & Underfills
• LED Encapsulent Material
• Photo-imageable dielectric materials for packaging and bonding

Lithography

• Deep UV Photoresists
• I-line; G-line; Broadband DNQ resists
• Chemically Amplified I-line application
• Photo-imageable dielectric materials for packaging and bonding
• Contrast Enhancement Materials
• Barrier Coats
• Adhesion Promoters

Photomask & Pellicles

• Pellicles
• Mask Blanks

PBN

• Crucibles & Other Products
• PBN/PG Heaters

Quartz Wafers & Substrates

• Wafers
• Substrates
• Nanoimprint templates

Other Products

• Flexible Circuits
• Solution Vinyl Resins
• Lithium Tantalate Wafers
• Lithium Niobate Wafers
• Optical Coatings

Shin-Etsu MicroSi product lines have been developed in close cooperation with leading integrated circuit and semiconductor manufacturers in the United States and Japan. The high purity and batch-to-batch consistency of Shin-Etsu MicroSi's application specific lines are unsurpassed