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ShinEtsu MicroSi, Inc.

D2D

Leading in research, development and manufacture of materials for the semiconductor industry.

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Customer Bulletin: 

          Unauthorized Thermal Interface Materials

Shin-Etsu Silicone Thermal Greases


These silicone fluid compounds contain thermally-conductive fillers. With their high thermal conductivity values, these products are ideal for use as the primary thermal interface material (TIM 1 and TIM 2) for CPUs, MPUs and GPUs. G765 has a high insulation resistance, while the other compounds were formulated to emphasize thermal conductivity. X23-7762 and X23-7783D product offerings were formulated emphasize high bulk thermal conductivity values and ease of workability.




GREASE SELECTION CHART

X23-7783D Data Sheet X23-7762 Data Sheet G-751 Data Sheet G-765 Data Sheet

As developers continue to create microprocessors that are smaller, faster and hotter than their predecessors, the ability to dissipate the heat generated by these devices is critical to the overall performance and longevity of the platforms that incorporate them they are in. Shin-Etsu MicroSi is committed to meet these needs by providing a wide variety of thermally conductive products.

Shin-Etsu Chemical has developed thermal solutions and are the recognized as the world leader in thermal interface material (TIM) applications.


Shin-Etsu MicroSi Thermal Interface Material

General Properties - Grease

Item   G765 G751 X23-7762 X23-7783D
Appearance Gray Grease
Specific gravity 25°C 2.77 2.51 2.55 2.55
Viscosity (Pa•s) 25°C 250 400 180(600*) 200(800*)
Oil separation (%) 150°C 24h 0.01 0.01 -- --
Thermal conductivity
(W/m•°C)
  3 4.5 4.0(6.0*) 3.5(6.0*)
Volume resistivity
(TΩ•m)
  0.1 0.008 --  
Dielectric breakdown
voltage (kV)
0.25mm 4.5 Below measurement limit
Usage temperature
range (°C)
  -50+120      
Volatile constant
(%)
150°C/24h 0.06 0.1 2.58 2.43
Low-molecular-weight
silicon content (ppm)
ΣD3~D10 Less than 100

Packaging


Shin-Etsu MicroSi's thermal interface material is available in several cost effective packages which include syringes, cartridges and bulk containers.

Shin-Etsu MicroSi’s syringes are ideal for manual applications. Pre-filled syringes assure that a consistent shot weight is applied to the intended surface. Shin-Etsu MicroSi’s SQC processes provide a consistent dispense weight with each syringe. The Syringe Delivery Method provides the most flexibility for an organization, with the ability to utilize the same product package for production and field requirements without additional investment in application tools.

Bulk delivery provides the lowest possible unit cost. Bulk purchases are available for large scale production facilities where material is consumed at a rapid rate.


Thermal Grease
Thermal Gel
Pads & Phase Change Material
Molding Compounds
Encapsulents & Underfills
LED Encapsulent Material
Photo-imageable Dielectric Materials
Interposers
Inter-Connectors

480.893.8898


10028 S. 51st Street,
Phoenix, AZ 85044