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Shin-Etsu MicroSi, Inc. |
MEDIA
CENTER |
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Thick
Copper Pillar Bump Fabrication
article published in
Advanced Packaging Nov 2007
http://ap.pennnet.com/display_article/312377/36/ARTCL/none/none/1/Thick-Copper-Pillar-Bump-Fabrication/ |
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Where to Find Us - 2008 Trade Shows |
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Strategies in Light - Santa Clara -
February 12 - 13, 2008 - Booth 400
SPIE - Microlithography - San Jose, Ca - February 26 -
27, 2008 - Booth 707
MEPTEC - Thermal Management Issues - San
Jose, Ca - February 28, 2008
SEMI-THERM - San Jose, Ca - March 16 - 20, 2008
ECTC/ITHERM - Walt Disney World - May 28- 29,
2008
SEMICON West 2008 - San Francisco, Ca - July 15 - 17, 2008 -
LED - San Diego, Ca - Sept. 29 - Oct. 1, 2008 |
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Where to Find Us - 2007 Trade Shows |
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Strategies in Light - San Jose -
February 12 - 14, 2007
MEPTEC - Thermal Management Issues - San
Jose, Ca - February 15, 2007
SPIE - Microlithography - San Jose, Ca - February 26 -
March 1, 2007
SEMI-THERM - San Jose, Ca - March 20 - 21, 2007
ECTC/ITHERM - 57th Electronic Components - Reno, NV - May 29- June
1, 2007
SEMICON West 2007 - San Francisco, Ca - July 16 - 20, 2007 -
Booth 5165
LED - San Diego, Ca - October 24-26, 2007 |
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Where to Find Us - 2006 Trade Shows |
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Strategies in Light - San Francisco -
February 15 - 17, 2006
MEPTEC - Thermal Management Issues - San
Jose, Ca - February 16, 2006
SPIE - Microlithography - San Jose, Ca - February 21 - 22,
2006 Booth 1113
SEMI-THERM - Dallas, Tx - March 14 - 15, 2006 Booth 18
ECTC/ITHERM - 55th Electronic Components - San Diego, Ca - May 31 - June 1,
2006
SEMICON West 2006 - San Francisco, Ca - July 11 - 13, 2006
SPIE - BACUS - Monterey, Ca. - September 19 - 20, 2006 |
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Shin-Etsu Introduces Novel Photoresists for Plating and Dielectric
Films for Bump Processing and Thick Resist Applications |
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PHOENIX--(BUSINESS WIRE)--April 5,
2006--Shin-Etsu announced the development and release of two new
photoresist materials for dielectric films and thick plating bump
applications.
New Photoresists
16KB |
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A Novel
Photosensitive Material for Redistribution and Stress Buffer
Reduction on 300mm Wafers |
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SINR demonstrates the mechanical and
electrical properties need for both a stress buffer application and
redistribution application.
Novel Photosensitive Material
335KB |
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Shin-Etsu MicroSi
Announced their standard TIM II Thermal Interface Material Meets
RoHS environmental requirements. |
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Shin-Etsu
MicroSi, Inc. is pleased to announce that our standard TIM II
thermal interface materials meet the requirements of the European
Union’s Restriction of Hazardous Substances in Electrical and
Electronic Equipment, RoHS Directive 2002/95/EC.
RoHS Press Release
10KB
MSDS Web Request - RoHS |
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Shin-Etsu MicroSi
Announces New Line of Adhesiveless Flexible Copper Laminates
Adhesiveless Press Release
10KB |
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The “KN Series” products are a single
sided copper construction while the “KV Series” is a double sided
copper construction. |
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Where to Find Us - 2005 Trade Shows |
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MEPTEC - Thermal Management Issues - San Jose, Ca - February 16, 2005
SPIE - Microlithography - San Jose, Ca - March 1 - 2, 2005
SEMI-THERM - San Jose, Ca - March 15 - 17, 2005
ECTC - 55th Electronic Components - Lake Buena Vista, FL- June 1-2,
2005
SEMICON West 2005 - San Francisco, Ca - July 11 - 15, 2005 |
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Characterization of 100 Micron Thick
Positive
Photoresist on 300 mm Wafers |
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SPIE
2005 Paper
328KB |
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This study developed a process for a
single coat, positive tone, 100µm
photoresist for bump processing on 300 mm wafers. |
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Altera selects Shin-Etsu
Chemical’s thermal Interface Material |
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Altera
selects Shin-Etsu
68KB |
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Altera Corporation has selected Shin-Etsu's thermally conductive interface gel material in the packaging of its high-end Stratix II FPGA family. Shin-Etsu's material exhibits excellent thermal characteristics, and its low modulus helps absorb stress between the integrated heat spreader in the package and pressure sensitive-low-k dielectric material in the silicon. |
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Shin-Etsu MicroSi awarded AMD’s prestigious Pathfinder Award |
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Pathfinder
Award 47KB |
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Shin-Etsu MicroSi awarded AMD's prestigious Pathfinder Award AMD awarded its Pathfinder Award for Best Supplier to Shin-Etsu MicroSi and three other companies. Shin-Etsu MicroSi received the award for exceptional technology support and commitment for developing Thermal Interface Materials for microprocessors.
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CEM Temperature and Shelf life Requirements
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CEM Temperature and Shelf life Requirements
32KB
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Shin-Etsu MicroSi completed temperature and shelf-life testing on our CEM product line. This extensive evaluation allowed us to double some of the CEM shelf-life dates.
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Characterization of an Ultra-Thick Positive Photoresist for Electroplating Applications
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SPIE Triquin Paper
1MB
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This study shows that Shin-Etsu SIPR 7120M photoresist has well balanced lithographic properties, allowing it to be coated and exposed at 100µm thick with a single coat process. SIPR7120M is a positive acting; acid catalyzed based material that can be easily processed.
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Contrast Enhancement Materials for Thick Photoresist
Applications |
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CEM Paper
2.5MB
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This study examines the feasibility of processing moderate and high
contrast positive photoresists at 40µm thickness with a top of CEM.
The use of CEM dramatically improves the lithographic performance
for both Shin-Etsu 9740 and Clariant AZ P4620. |
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Characterization of a Novel Photoresist Redistribution Material for
Advanced Packaging Applications
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Ultratech Paper
1.8MB
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This study details the feasibility of processing SINR 3170M
photoresist on an Ultratech Saturn Spectrum 3 stepper for a
redistribution level. SINR 3170M is a negative acting, acid
catalyzed, siloxane based material that can be easily processed. |
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Contrast Enhancement Materials for Yield Improvement in
Submicron I-line Lithography |
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CEM I-line
301KB
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By implementing CEM 365iS with the existing resist process, we were
able to improve the DOF by about 0.7µm with sufficient exposure
latitude.
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