Flexible Copper Laminates

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	FCL Info Sheet 357KB FCL Selection Guide 97KB Process Guidelines 32KB		Product Specifications Laminates 4.0KB Coverlays & Bonding Sheets 4.0KB Adhesiveless 4.0KB

FCL and coverlay films are the primary materials used in the construction of flexible printed circuit (FPC) boards. FCL is copper laminate in which the conductor (copper) is laid as a base for dielectric film.

FCL PROPERTIES

Uniform and stable adhesion of the copper foil to the base film.
Soldering, heat-resistance temperature < 350° C.
Excellent dimensional stability is maintained throughout the entire FPC manufacturing process.
The outstanding flexural fatigue resistance makes it ideal for small-radius settings and reciprocating motion.
Superior Electrical characteristics.

APPLICATION

As indicated by the name, flexible circuit boards can bend freely along the curves of the products of which they are the components. FPCs are used for various electric and electronic products such as cameras, notebook PCs, mobile phones, HDDs, FDDs and CD-ROM drives. As these products become increasingly compact, their circuits must allow electric signals to flow within a very limited space.

PERFORMANCE

The copper foil and polyimide film used in our FCL materials is laminated using a proprietary and unique process, yielding improved peel strength, greater dimensional stability and excellent flexural endurance.

Shin-Etsu MicroSi’s FCL provide a higher resistance to soldering heat, (>330?°C) as compared to other epoxy based laminates. Our Coverlay materials can be processed at lower temperatures (160?°C) and have higher flexural endurance.

Our material is UL approved (UL V-0) and is suitable for commercial circuits.

FCL Info Sheet 357KB
FCL Selection Guide 97KB

FCL TYPICAL PROPERITIES