Home > Products > Packaging Products > Thermal Interface Materials > Encapsulants & Underfills
Encapsulants & Underfills PACKAGING PRODUCTS
Thermal Interface Materials
Molding Compounds
Encapsulants & Underfills
LED Encapsulant Material  
Interposers
Connectors
     
 
Shin-Etsu Liquid Coating Materials - KJR Series & SEMICOAT Series 410KB
 
     
Encapsulants & Underfills

Ionic high purity Electronic grade silicone resins are used to protect semiconductor elements and electronics parts both magnetically and mechanically. Shin-Etsu MicroSi offers a full line of Junction Coating Resins. These high purity silicone-based polymers provide outstanding electrical, mechanical and thermal stability and excellent adhesive strength for junction coating applications. 

  KJR Series
Typical applications for Shin-Etsu KJR Series products are depicted below:
A. GTO Thyristor Coating  B. Hybrid IC Chip Coating
C. Thermal Head Coating D. Photo Diode Coating
E. LCD Electrode Protection Coating F. Other Optical devices

Controlled Refractive Index
High Transparency
None yellowing after stress test 

The KJR Series offers very low Ionic impurities. These products are extremely pure, providing superior stability to all types of semiconductor devices. The most critical impurity, chloride ion, is kept to an absolute minimum, greatly reducing the risk of electrode corrosion. 

Shin-Etsu KJR series can be classified into three categories according to the chemical curing mechanism used. The manufacturing process and or the specific characteristics of the device may dictate which product group will best fit your requirement.

Rigid: After curing, this coating material hardens to a highly rigid polyimide. It has excellent adhesive properties and is an ideal coating for particularly high voltage resistant devices.

Flexible: After curing, this coating material has outstanding rubber elastic properties. By absorbing stress due to external forces, it can prevent fracturing of the devices.

Gel: After curing, this coating material is a soft gel type material. It has extremely low stress and provides the maximum buffer effect available. Its superb adhesion strength and lead sealing, it provides the best humidity protection.


The curing conditions for some of the KJR products are listed below:
Product Type Product Name

Cure Condition

Flexible
9051E; 9052E
9022E; 9023E; 9050E
9033E; 9060E; 9061E
4010E; 4013E; 4012E; 4050E
80~100°C/1~4 hrs
100~150°C/1~4 hrs
100~150°C/1~4 hrs
20~25°C/45~65% RHD/24Hr
+150°C/1~4 hrs
Gel
9010E; 9015E
9014E; 9017E
100~150°C/1~4 hrs
150~170°C/1~4 hrs
Rigid
651E;
654E
653E
150°C/1Hr+200°C/1Hr+
250°C/4Hr
150°C/1Hr+200°C/16Hr
  SEMICOAT Series

Typical applications for Shin-Etsu SEMICOAT liquid epoxy coating agents for semiconductor applications are low stress, lead free (IR=260°C) and low K dielectric die compatible. Some of the applications are shown below:

Please contact Shin-Etsu MicroSi to obtain specific product offerings and technical data. 

Shin-Etsu patent low stress technology provides extremely low stress performance. 
Back To Top ^