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Interposers are an excellent way to isolate silicon layers and provide spacing for stacked dies applications. This benefit can be realized while using standard manufacturing equipment, such as die sawing and bonding machines. Therefore, capital expenditures are kept to a minimum with an efficient manufacturing process. The basic structure includes a blank wafer coated with a thin layer of adhesive on each side. Unique polyamide hybrid and silicone formulations are available. ShinEtsu’s low stress high adhesion technology allows the interposer to be used in lead free low K applications. Total thickness can be a thin as 100mm.
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