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Molding
Compounds
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PRODUCT DESCRIPTION
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Shin-Etsu is a leader in developing advanced packaging materials for encapsulating all types of semiconductor devices. This broad line of products offers low stress, very low warpage, and high thermal conductivity.
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- Excellent reliability
- Ultra low internal stress
- Low levels of ionics
- Excellent moldability
- Nonflammable
- Low a particle counts (VA grade)
- Sb/Br free (green compound)
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Shin-Etsu is a world leader in Silicone and epoxy molding compound technology. We have nearly fifty years of experience in the field of silicones and are one of the largest manufactures in the world. Shin-Etsu holds the patent for the basic catalyst for epoxy molding compounds along with the basic patent for silicone softener technology related to epoxy molding compounds. Shin-Etsu is a basic supplier of many of the raw materials used in this product line, including silicone
softners, silicone coupling agents, synthetic silica and aluminum oxide.
In 1991 the Japanese Minister of international trade and industry awarded Shin-Etsu a national invention award for our technology in stress reduction of epoxy resins. Our method of dispersing silicone in our epoxy resin allows us to reduce the number of flexural modulus, maintain excellent heat resistance and a high glass transition temperature, thus reducing total internal stress. As a result of this new technology, the long term reliability of semiconductor devices encapsulated with Shin-Etsu epoxy molding compounds has been drastically improved.
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LEAD FRAME |
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POWER DEVICES |
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LAMINATES |
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GREEN COMPOUNDS -
ANTI POPCORN FOR LEAD FREE SOLDERING |
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TYPICAL PROPERTIES |
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Unit |
KMC-184 |
KMC-260 |
KMC-288P |
KMC-289 |
| Spiral Flow |
cm |
80 |
100 |
80 |
100 |
| Gelation Time |
sec |
20 |
16 |
15 |
16 |
| Flexural Strength |
N/mm2 |
130 |
140 |
150 |
150 |
| Flexural Modulus |
N/mm2 |
13,000 |
23,000 |
23,000 |
23,000 |
| Glass Transition Temp. |
degreeC |
165 |
160 |
145 |
140 |
| Coefficient of
Alpha 1 |
E-5/
degreeC |
1.3 |
1.0 |
1.0 |
1.1 |
thermal expansion
Alpha 2 |
E-5/
degreeC |
5.6 |
3.5 |
4.0 |
4.5 |
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Unit |
KMC-184 |
KMC-260 |
KMC-288P |
KMC-289 |
| Spiral Flow |
cm |
60 |
110 |
90 |
90 |
| Gelation Time |
sec |
20 |
19 |
20 |
20 |
| Flexural Strength |
N/mm2 |
140 |
150 |
150 |
150 |
| Flexural Modulus |
N/mm2 |
31,000 |
24,000 |
24,000 |
24,000 |
| Glass Transition Temp. |
degreeC |
190 |
125 |
150 |
125 |
| Coefficient of
Alpha 1 |
E-5/
degreeC |
1.4 |
1.0 |
1.0 |
1.0 |
thermal expansion
Alpha 2 |
E-5/
degreeC |
4.2 |
3.5 |
3.5 |
3.5 |
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