Composite Pads

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Composite Pads

PACKAGING PRODUCTS



	Thermal Interface Materials Molding Compounds Encapsulants & Underfills LED Encapsulant Material Interposers Connectors

PRODUCT DESCRIPTION

Shin-Etsu MicroSi’s Composite Thermal Interface Material offers an effective alternative for thermal solutions where a phase change material is more appropriate than grease, and re-workability of the device is desired. Our composite materials are available with either a thermal conductive elastomer, an aluminum film or a graphite sheet bonded to our phase change material. The phase change material softens around 48°C and compensates for surface irregularities of the heat sink, thus reducing contact resistance.

Shin-Etsu MicroSi offers three products that share the following properties

Good thermal conductivity
Low thermal resistance
Easily removed for device re-work
Excellent initial (assembly) and long term adhesion
Excellent processability and transfer to the heat sink
Thermally stable products
Products are supplied on rolls, tabbed and diced to custom sizes

	X-65-843-3	PCS-A-10	PCS-GF-10	X-65-843	X-65-843-2	PCS-GF-10
Thickness µm	160	110	185	300	400	230
Softening Point °C	48	48	48	48	48	48
Thermal Resistance (°C /W: 3kgf • cm torque is applied) (N=5)	Av. 0.09	Av. 0.03	Av. 0.05	Av. 0.39	Av. 0.52	Av. 0.11