Phase Change Material

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Phase Change Material

Shin-Etsu MicroSi’s Phase Change Material product line offers an effective alternative for thermal solutions where a phase change material is more appropriate than grease. Our thermally conductive phase change materials soften around 48°C and flows into surface irregularities of the heat sink and device package, thus reducing contact resistance.

Shin-Etsu MicroSi offers three products that share the following properties:

High thermal conductivity
Very low thermal resistance which improves with aging
Applying heat and pressure further lowers the thermal resistance.
Excellent initial (assembly) and long term adhesion
High breakdown voltage (PCS-TC-20)
Excellent processability and transfer to the heat sink
Thermally stable products
Products are supplied on rolls, tabbed and diced to custom sizes

The following chart details the general properties of these products.

GENERAL PROPERTIES

	PCS-TC-10	PCS-TC-11	PCS-TC-20
Features	Low Thermal Resistance	General Purpose	Improved Electrical Properties
Color	Gray	Gray	White
Thickness µm	60	130	100 , 200
Specific Gravity 25°C	2.5	2.5	3.3
Softening Point °C	48	48	48
Thermal Conductivity W/m-°C	4	3.8	3.3

Thermal Resistance °C cm2 /W	75 µm	0.26	0.27	0.28
	50 µm	0.21	0.22	0.22
	25 µm	0.16	-	0.14