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Thermal
Gel X23-7772-4
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PRODUCT DESCRIPTION
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Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X-23-7772-4 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X-23-7772-4 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X-23-7772-4 is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive gel has been successfully used throughout the semiconductor industry on temperature sensitive components.
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Thermal Gel X23-7772-4 Data Sheet
 44KB
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Thermal Gel X23-7772-4 PROPERTIES
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| Property |
| Viscosity (Pascal Second) |
270 |
| Appearance |
Gray |
| Bleed (425 °K/24 hr) |
0 |
| Volatile Content |
< 0.39% |
| Specific Gravity |
2.4 |
| Thermal Conductivity(W/m °K) |
3.5 |
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| Packaging Description |
Cartridges
Custom Sizes Available
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30 gm to 160 gm |
| Storage Conditions |
- 40°C |
| Cure Conditions |
125°C/ 90 min |
| Thaw Time |
90 – 100 min |
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Thermal Gel X23-7772-4
APPLICATION |
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Shin-Etsu MicroSi can provide X-23-7772-4 in 30 cc to 6.0oz cartridges. The cartridge delivery system can be utilized with automated equipment to minimize waste and provide an accurate dispense weight. The cartridge delivery system allows dispensing of the material, while protecting the integrity and exposure level of the unused portion.
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Thermal Gel X23-7772-4
PERFORMANCE |
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This curing silicone gel is a homogenous adhesive with unique fillers that enhance thermal conductivity. X-23-7772-4 is supplied in grease form. When exposed to ambient temperatures the material starts to cure, forming an excellent interface between substrates providing excellent thermal conductivity. |
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