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Shin-Etsu Silicone
Thermal Greases |
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These silicone fluid compounds contain
thermally-conductive fillers. With their high thermal conductivity
values, these products are ideal for use as the primary thermal
interface material (TIM 1 and TIM 2) for CPUs, MPUs and GPUs. G765
has a high insulation resistance, while the other compounds were
formulated to emphasize thermal conductivity. X23-7762 and X23-7783D
product offerings were formulated emphasize high bulk thermal
conductivity values and ease of workability.
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GREASE SELECTION CHART |
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As developers continue to create microprocessors that are smaller,
faster and hotter than their predecessors, the ability to dissipate
the heat generated by these devices is critical to the overall
performance and longevity of the platforms that incorporate them
they are in. Shin-Etsu MicroSi is committed to meet these needs by
providing a wide variety of thermally conductive products.
Shin-Etsu Chemical has developed thermal solutions and are the
recognized as the world leader in thermal interface material (TIM)
applications.
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Shin-Etsu MicroSi Thermal Interface
Material
General Properties - Grease |
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Item |
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G765 |
G751 |
X23-7762 |
X23-7783D |
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Appearance |
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Grey Grease |
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Specific gravity |
25°C |
2.77 |
2.51 |
2.55 |
2.55 |
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Viscosity (Pa•s) |
25°C |
250 |
400 |
180(600*) |
200(800*) |
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Oil separation (%) |
150°C 24h |
0.01 |
0.01 |
-- |
-- |
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Thermal conductivity (W/m•°C) |
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3 |
4.5 |
4.0(6.0*) |
3.5(6.0*) |
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Volume resistivity (TΩ•m) |
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0.1 |
0.008 |
-- |
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Dielectric breakdown voltage (kV) |
0.25mm |
4.5 |
Below measurement limit |
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Usage temperature range (°C) |
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-50+120 |
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Volatile constant (%) |
150°C/24h |
0.06 |
0.1 |
2.58 |
2.43 |
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Low-molecular-weight silicon content (ppm) |
ΣD3~D10 |
Less than 100 |
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PRODUCT DESCRIPTION
Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s G-751 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of G-751 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s G-751 is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.
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G-751 Data Sheet 
114KB
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G-751 PROPERTIES
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| Viscosity (Pascal Second) |
250 – 400 |
| Appearance |
Gray |
| Volatile Content |
< 1.0% |
| Specific Gravity |
2.5 |
| Thermal Conductivity(W/m °K) |
4.5 |
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| Thermal Grease G-751 is available in: |
- Syringes
- Cartridges
- Bulk
- Custom Sizes Available
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0.5 gm, 1.0 gm, 1.5
gm
55 gm, 150 gm, 400 gm
2.0 Kg |
| Storage Conditions |
60°F to 85°F (15°C - 29°C) |
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G-751 APPLICATION |
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Shin-Etsu MicroSi’s G-751 material is available in several cost effective packages which include syringes, cartridges and bulk containers.
Syringes
Shin-Etsu MicroSi’s syringes are ideal for manual applications. Pre-filled syringes assure that a consistent shot weight is applied to the intended surface. Shin-Etsu MicroSi’s SQC processes provide a consistent dispense weight with each syringe. The Syringe Delivery Method provides the most flexibility for an organization, with the ability to utilize the same product package for production and field requirements without additional investment in application tools.
Cartridges
For medium to large production applications, Shin-Etsu MicroSi can provide G-751 in cartridges. The cartridge delivery system can be utilized with either manual, automated or silk-screening equipment. The cartridge delivery system allows dispensing of the material, while protecting the integrity and exposure level of the unused portion.
Bulk Containers
Bulk delivery provides the lowest possible unit cost. Bulk purchases are available for large scale production facilities where material is consumed at a rapid rate. |
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G-751 PERFORMANCE |
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A key factor in selecting a thermal interface material is the relationship between bond line thickness (BLT) and thermal resistance. The chart on the left illustrates very low thermal resistance at different bond line thicknesses.
The Viscosity of G-751 allows for consistent dispense patterns when utilizing stencil printing or automated dispense machines. This advantage allows for tighter control in the use of and dispensing of the thermal interface material. |
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