|
Developers continue to create microprocessors that are smaller and faster than their predecessors. The ability to dissipate the heat generated by these newer devices is critical to the performance and longevity of the products they are in. Shin-Etsu MicroSi is committed to meet these needs by providing a wide variety of thermally conductive products.
We have developed thermal solutions and are the recognized as the world leader in thermal interface material (TIM) applications. |
