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Adhesion Promoters

PHOTOLITHOGRAPHY PRODUCTS


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Adhesion Promoters to Enhance Photoresist Bonding

Adhesion promoters are used to enhance the bonding of photoresist to a silicon dioxide surface. Shin-Etsu MicroSi’s MicroPrime™ line of adhesion promoters readily react with the substrate material removing absorbed water and reducing surface energy. The resulting water repellent hydrophobic interface prevents etchants from undercutting the photoresist.

Shin-Etsu MicroSi has developed three MicroPrime™ product lines for the semiconductor industry. These products are based upon hexamethyldisilazane (HMDS); N,N-diethylaminotrimethylsilane (DEATS) and propylene glycol monomethyl-ether acetate (PGMEA) chemistry.

Specialty Adhesion Promoters

To enhance the effectiveness of thickfilm photoresist to copper and gold surfaces Shin-Etsu MicroSi offers two specialty adhesion promoters.

Selection Guide

Adhesion Promoter	Product Composition	Application

MicroPrime HP Primer	100% (HMDS)	Highly purified grade of hexamethyldisilazane (HMDS) manufactured specifically for semiconductor applications

MicroPrime MP-90	>99.0% HMDS <1.0% DEATS	HMDS modified specifically for vapor track priming in the highly automated semiconductor lithography process. These products provide an increased contact angle that can improve adhesion characteristics on difficult substrates. An increase in the reaction mechanism provides a shorter prime dwell cycle, thereby improving throughput.

MicroPrime MP-95	>99.5% HMDS <0.5% DEATS

MicroPrime MS8011	100% diethylaminotrimethylsilane (DEATS)	This superior adhesion promoter is for the treatment of silicon dioxide surfaces prior to photoresist application. It is formulated as a high purity, low residue material specifically designed for VLSI applications.

MicroPrime MP-P20	20% HMDS 80% PGMEA	HMDS modified specifically for spin on semiconductor lithography process.

Metal Adhesion Promoters	Proprietary	Copper Surfaces

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