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MicroPrime MP-95 |
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MicroPrime MP-95 Adhesion Promoter
(CH3)3SiNHSi(CH3)3
/ (CH3)3SiN(C2H5)2
High Efficiency
Track Vapor Prime Adhesion Promoter |
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MicroPrime
MP-95 Data Sheet 
165KB
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PROPERTIES
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MicroPrime MP-95 Adhesion Promoter is a blend of hexamethyldisilazane and N,N-diethylaminotrimethylsilane (HMDS and DEATS) optimized for efficient, high H2O contact angle, vapor priming on semiconductor in-line track coating equipment. The combination of DEATS, an aminofunctional silane, with HMDS provides a more highly reactive surface treatment to reduce photoresist lifting on
common semiconductor surfaces including silicon, poly, oxide nitride, Silicides and
BPSG. MicroPrime MP-95 Adhesion Promoter is completely compatible with components with which HMDS is compatible.
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Physical Properties |
| Empirical Formula |
C6H19NSi2/
C7H19NSi
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| Density, 25°C |
0.767 |
| Boiling Point |
126°C |
| Flash Point |
10°C |
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Specification Data |
| Purity, min % |
≥
99.0% |
| Residue, max |
≤ 3.0 ppm |
| Chloride |
≤ 0.5 ppm |
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Application
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MicroPrime MP-90 Adhesion Promoter can be
applied to oxide substrates by several techniques, including
vapor prime, spinning and spraying. Environmentally stable
primed substrates with uniform coverage are obtained by
treatment in vapor deposition tracks and ovens. This efficient
method of application offers rapid and uniform reproducible
priming of substrates with a minimum quantity of MicroPrime
MP-90 Adhesion Promoter.
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Typical * Elemental Impurities |
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Less that 5ppb each |
| Al |
Aluminum |
| As |
Arsenic |
| Au |
Gold |
| B |
Boron |
| Ca |
Calcium |
| Cu |
Copper |
| Fe |
Iron |
| K |
Potassium |
| Na |
Sodium |
| Pb |
Lead |
| Sb |
Antimony<10ppb |
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*Purity can be
certified to these levels in high purity containers.
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Apply a small amount of MP-90 Adhesion Promoter neat to a wafer spun at 3000-5000 rpm at ambient temperature. Pre-bake at 70-150°C. Post-exposure bake at 70-150°C.
This aminofunctional, low viscosity organosilane is more reactive with the hydroxyl radicals on silicon dioxide than hexamethyldisilazane (HMDS). Therefore, use of MicroPrime MP-90 results in greater coverage and more efficient surface treatment in a shorter time.
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Reaction Mechanism
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MicroPrime MP-95 Adhesion Promoter reacts readily with silicon oxide surfaces (metal oxides, silicon dioxide, etc.) removing adsorbed water and reducing substrate surface energy. Further reaction then occurs between MicroPrime MP-95 Adhesion Promoter and surface hydroxyls (silanols, metalhydroxides) resulting in a trimethylsiloxylated surface and prevention of future adsorption of water and other polar materials. During this process, small amounts of diethylamine and ammonia are produced. MicroPrime MP-95 Adhesion Promoter functions as a surface modifying agent. Photoresist will then coat these surfaces more uniformly; problems of photoresist lifting and subsequent undercutting are reduced.
MicroPrime MP-95 Adhesion Promoter is designed and recommended for track vapor priming in semiconductor lithography processes.
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Packaging
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MicroPrime MP-95 Adhesion Promoter is available is 1 pint, 1 quart and 1 gallon glass bottles and various Now Pak®* containers for efficient use. MicroPrime MP-95 Adhesion Promoter is filtered to 0.1 micron for semiconductor process applications.
Contact your Shin-Etsu MicroSi representative regarding high purity package options including stainless steel canisters.
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Shelf Life
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MicroPrime MP-95 Adhesion Promoter is stable for over one year in an unopened container. Once opened, atmospheric moisture will react with MicroPrime MP-95 Adhesion Promoter, slowly reducing purity. Resealing opened containers under dry nitrogen will lengthen shelf life.
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Cautions in Handling
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Hexamethyldisilazane and N,N-diethylaminotrimethylsilane can cause severe burns to eyes and skin. In case of contact with the eyes, immediately flush with water for at least 15 minutes and get prompt medical attention. In case of skin contact, flush with water, wash with soap and water, and contact a physician. The material should be handled only in areas with adequate ventilation to avoid excessive exposure to solvent vapors.
Contact with moisture will produce hexamethyldisiloxane, ammonia and diethylamine.
N,N-diethylaminotrimethylsilane is a flammable, corrosive liquid.
In the event of fire, use dry powder or CO2 for small fires, foam for large fires. Avoid direct streams of water.
Please refer to Material Safety Data Sheets prior to using MicroPrime MP-95 Adhesion Promoter.
*Now Pak® is a registered trademark of NOW Technologies, Inc.
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