Technology can pave the way for a better world. Starting small but thinking big is key to future technologies. We at Shin-Etsu MicroSi believe that creating value is about providing our customers with solutions that will strengthen and enhance the value of their products. We approach our business with a customer focus and we develop and execute to meet and exceed our customers’ expectations. We work with the foremost manufacturing companies in the semiconductor, photonics, automotive and coatings industries.
Drawing upon the extensive, electronic, lithography material expertise developed from our chemical manufacturing field, Shin-Etsu offers the latest high-quality and high-performance KrF photoresists, ArF photoresists, F2 photoresists, spin-on hardmasks, and other lithography materials related to the semiconductor production process. Our line of lithography material products employ a variety of methods
5G & Automotive The Shin-Etsu Group, utilizing resources from multiple divisions, offers an extensive product line of traditional packaging materials and materials for advanced packaging; including 2.5D and 3D. Shin-Etsu MicroSi is the leader in Thermal Interface Material, and we have developed an extensive line of Molding Compounds, Encapsulents, Silicon
Shin-Etsu has developed a number of products that are uniquely suited for MEMS mounted sensors, smaller package devices and high performance integrated devices. We have
TIM 1 – Thermal Gel Shrinking die and increasing power demands continue to make thermal conductive compounds a critical part of IC package design. The
Optical isolators are devices that allow the transmission of laser beams emitted from a laser diode to travel in only one direction. When built into
Shin-Etsu has developed a number of products that are uniquely suited for MEMS mounted sensors, smaller package devices and high performance integrated devices. We have separated these products into Sensor Manufacturing and Sensor Packaging & Assembly. Sensor Manufacturing: Photoresists – Our broadband, I-line and G-line spin on photoresists are formulated to
TIM 1 – Thermal Gel Shrinking die and increasing power demands continue to make thermal conductive compounds a critical part of IC package design. The use of silicone gel is necessary for proper heat dissipation, to improve performance and reliability of devices by enabling packages to run cooler. Shin-Etsu’s thermal
Optical isolators are devices that allow the transmission of laser beams emitted from a laser diode to travel in only one direction. When built into high power laser modules such as Fiber Laser sources for material processing, they protect the laser diode by intercepting light reflected back from the materials.
Inspiring customer growth, employee growth, and company growth.
Shin-Etsu MicroSi, Inc. is committed to the continuous success and growth of our customers. We provide a challenging work environment expecting our employees to achieve their highest potential by promoting personal and professional growth and teamwork. We will continue to increase shareholder value for our parent company, Shin-Etsu Chemical, while expanding our influence in all markets we serve.
Softening market conditions and rising uncertainty in global trade and economy have impacted semiconductor spending from
In the long unfolding arc of technology innovation, artificial intelligence (AI) looms as immense. In its
Although the total volume of data is expected to grow exponentially from proliferating technologies such as
Intel Showcases New Chip Packaging Powers Packaging has perhaps never been a hotter subject in popular
