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2.5D and 3D Packaging Material Technologies

IC packaging, or integrated circuit packaging, is the final stage of semiconductor device fabrication. The block of semiconducting material is enclosed and encased in a “package” or a supporting case with either temporary bonding material, or permanent packaging with dry film 3D bonding material. Semiconductors are susceptible to both physical damage and corrosion, and the packaging supports the electrical contacts which connect the device to a circuit board.

From 2.5D to 3D Packaging Material

3D Packaging is a newer packaging technology which uses the die stacking technique. It was developed in response to the needs of the higher density semiconductor memory chip found in CPU components. It essentially builds on the technologies represented by the 2.5 D packaging material in which tremendous capacity and performance increases were established, compared to the previous 2D models. It made it easier to make a large number of small die as opposed to a single large one. The concept behind the 3D packaging is to mount two or more dice on top of each other, creating insulation problems as the heat generated by multiple individual die is considerable. 3D and 2.5D integration materials are essential to this technology.

2.5D and 3D Packaging Temporary Bonding Material

Some applications, like processing of ultra-thin and fragile wafers, require temporary packaging solutions. These packaging materials are available as both spin-on and dry film materials. There are several benefits to using temporary bonding material in 2.5D and 3D packaging. These include high yield, ease of integration into an existing fabrication structure, and a reliable debonding step post processing. Temporary 2.5 and 3D packaging bonding materials enable wafer thinning.

Dry Film Permanent Bonding for 3D Packaging

A range of products are available for dry film permanent bonding with 3D packaging technologies. These include photosensitive dielectric materials for resdistribution wiring and stress buffer applications, wafer-level dry film resist. With 3D packaging,  dry film permanent bonding allows for optimization of wafer bonding. It is no secret that dry film permanent bonding is leading changes in the market when it comes to 3D packaging.

Electronic packaging is at the center of every electronic application. It interconnects the individual components, protects electronic systems against moisture and physical stresses, and dissipates heat reliably. Smarter and less expensive encasing of devices is key to bringing costs down. Advanced packaging solutions are constantly being researched and improved upon with the end result being better prices in the market for manufacturers and consumers alike.