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  • Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s G-751 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of G-751 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s G-751 is designed to meet...

  • Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design.Shin-Etsu MicroSi’s G-765 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of G-765 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s G-765 is designed to meet current...

  • Package temperature constraints can severely limit a power device’s performance. Both the performance reliability and life expectancy are inversely related to the device temperature. Shin-Etsu MicroSi’s X23- 7868-2D is an ideal thermal interface material for high performance based platforms. Description Excellent thermal resistance (TR) and thermal conductivity (TC) Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods ...

  • Thermal grease, X-23-7921-5, is a Non-Solvent type of thermal interface material developed by Shin-Etsu Chemical Co., Ltd. (hereinafter SEC) to meet the current and future thermal management requirements of high performance microprocessors. Its purpose is to increase heat sink effectiveness, and it is used to fill any air gap between the processor and the heat sink, because air is a thermal...

  • Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23- 7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23-7783D to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X23-7783D is designed to...

  • Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23- 7762 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23- 7762 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X23-7762 is designed...

  • X23-7869-2D, is a thermal interface material developed and manufactured by Shin-Etsu Chemical with ease of application in mind. Specifically formulated to include an application chemical to allow ease of screening and other application techniques. With a higher Thermal Conductivity coupled with lower Thermal Resistance exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7869-2D allows electronic...

  • Thermal grease, X23-7943, is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu MicroSi’s X23-7943 exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7943 allows electronic devices to remain cooler and increases their long term reliability. Typical applications include semiconductor devices: power transistors, ICs, CPUs, stacked memory modules or any application that requires a thermal solution. Description ...

  • Thermal grease, X23-7911, is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu MicroSi’s X23-7911 exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7911 allows electronic devices to remain cooler and increases their long term reliability. Typical applications include semiconductor devices: power transistors, ICs, CPUs, stacked memory modules or any application that requires a thermal...

  • Shin-Etsu Chemical’s High Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics. As demands for faster electronic devices increase, typically so does the amount of heat generated, requiring the need for higher degree of silicone hardness. If heat cannot escape efficiently, the performance of the device tends to...

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