Search Results for: thermal conductivity

Thermal Grease X23 -7911 - Shin-Etsu MicroSi

Thermal Grease X23-7911

hermal grease, X23-7911, is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu MicroSi’s X23-7911 exceeds thermal management requirements of high-performance semiconductor

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Thermal Grease X23-7943 - Shin-Etsu MicroSi

Thermal Grease X23-7943

Thermal grease, X23-7943, is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu MicroSi’s X23-7943 exceeds thermal management requirements of high-performance semiconductor

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Thermal Grease X23-79692D - Shin-Etsu MicroSi

Thermal Grease X23-7869-2D

X23-7869-2D, is a thermal interface material developed and manufactured by Shin-Etsu Chemical with ease of application in mind. Specifically formulated to include an application chemical to

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Thermal Grease G765 - Shin-Etsu MicroSi

Thermal Grease G765

Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s G-765 thermal interface material

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Thermal Grease G751 - Shin-Etsu MicroSi

Thermal Grease G751

Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s G-751 thermal interface material

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Chaline R170 170S - Shin-Etsu MicroSi

Thermal Grease X23-7762

Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23- 7762 thermal interface

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Thermal Grease X23-7783D - Shin-Etsu MicroSi

Thermal Grease X23-7783D

Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23- 7783D thermal interface

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Thermal Grease X23-7921-5 - Shin-Etsu MicroSi

Thermal Grease X23-7921-5

  Thermal grease, X-23-7921-5, is a Non-Solvent type of thermal interface material developed by Shin-Etsu Chemical Co., Ltd. (hereinafter SEC) to meet the current and

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