Two-layer sample processed by Shin-Etsu dual damascene method (Overhead view)
Press Release: Shin-Etsu Chemical: Developing equipment to manufacture semiconductor package substrates for the back end process and pursuing a new manufacturing method
—Contributing to the cost reduction of ongoing chiplet development— Shin-Etsu Chemical Co., Ltd. (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture semiconductor package substrates…