Our PGMEA, DEATS, and HMDS adhesion promoter is used to enhance the bonding of photoresist to a silicon dioxide surface. Shin-Etsu MicroSi’s MicroPrime™ PGMEA, DEATS, and HMDS adhesion promoter line readily reacts with the substrate material removing absorbed water and reducing surface energy. The water repellent hydrophobic interface resulting from the adhesion promoter prevents etchants from undercutting the photoresist.
Shin-Etsu MicroSi has developed three MicroPrime™ product lines for the semiconductor industry. The first is an HMDS primer (hexamethyldisilazane). This chemical is used to promote better adhesion. Using an HMDS primer has certain time advantages over other chemicals. The other two are N-diethylaminotrimethylsilane (DEATS) and propylene glycol monomethyl-ether acetate (PGMEA). Each adhesion promoter has different advantages, but all of them are equally effective.
Links to Safety Data Sheets:
Links to Technical Data Sheets:
MicroPrime HP Primer (850.71kB)
Specialty Adhesion Promoters:
To enhance the effectiveness of thickfilm photoresist to copper and gold surfaces Shin-Etsu MicroSi offers two specialty adhesion promoters.
Data Sheet Specialty Adhesion Promoters (365.99kB)
- Adhesion Promoter
- Product Composition
- 100% (HMDS)
- Highly purified grade of hexamethyldisilazane (HMDS) manufactured specifically for semiconductor applications
- 99.0% HMDS
- <1.0% DEATS
HMDS modified specifically for vapor track priming in the highly automated semiconductor lithography process. These products provide an increased contact angle that can improve adhesion characteristics on difficult substrates. An increase in the reaction mechanism provides a shorter prime dwell cycle, thereby improving throughput.
- 99.5% HMDS
- <0.5% DEATS
20% HMDS 80% PGMEA
HMDS modified specifically for spin on semiconductor lithography process.
- Metal Adhesion Promoters
- Copper and Gold Surfaces