Press Releases
Shin-Etsu Chemical to Launch Newly Developed Advanced Materials for 5G Related Products
Shin-Etsu MicroSi to Sell Thermal Interface Syringe Packages on Amazon
Shin-Etsu MicroSi Eclipses Milestone – 50 Millionth Thermal Interface Syringe Package Sold
Shin-Etsu MicroSi & Nissin Chemical Introduce two new products
Nissin Chemical and Shin-Etsu MicroSi Announce First Vinyl Resin
Thick Copper Pillar Bump Fabrication article published in Advanced Packaging Nov 2007
Thick Copper Pillar Pump Fabrication
Shin-Etsu MicroSi Announced their standard TIM II Thermal Interface Material Meets RoHS environmental requirements.
Shin-Etsu MicroSi, Inc. is pleased to announce that our standard TIM II thermal interface materials meet the requirements of the European Unions Restriction of Hazardous Substances in Electrical and Electronic Equipment, RoHS Directive 2002/95/EC.
RoHS Press Release 10KB
Shin-Etsu MicroSi Announces New Line of Adhesiveless Flexible Copper Laminates
The “KN Series” products are a single sided copper construction while the “KV Series” is a double sided copper construction.
Adhesiveless Press Release 10KB
