Thick Copper Pillar Bump Fabrication article published in Advanced Packaging Nov 2007
Shin-Etsu MicroSi Announced their standard TIM II Thermal Interface Material Meets RoHS environmental requirements.
Shin-Etsu MicroSi, Inc. is pleased to announce that our standard TIM II thermal interface materials meet the requirements of the European Unions Restriction of Hazardous Substances in Electrical and Electronic Equipment, RoHS Directive 2002/95/EC.
Shin-Etsu MicroSi Announces New Line of Adhesiveless Flexible Copper Laminates
The “KN Series” products are a single sided copper construction while the “KV Series” is a double sided copper construction.
Adhesiveless Press Release 10KB