The Shin-Etsu Group, utilizing resources from multiple divisions, offers an extensive product line of traditional packaging materials and materials for advanced packaging; including 2.5D and 3D. Shin-Etsu MicroSi is the leader in Thermal Interface Material, and we have developed an extensive line of Molding Compounds, Encapsulents, Silicon and Epoxy coatings along with die Attachment Materials. The quality of our thermal interface material is among the most advanced in semiconductor manufacturing and has a wide range of use in thermal interface material applications. Some of which include thermal gels and grease, phase change materials, and high hardness silicone rubber pads. Shin-Etsu’s line of 2.5D and 3D packaging material Shin-Etsu provides is delivered globally to many major and minor companies involved in the fabrication process of electronics and microelectronics.
Materials For The Automotive Industry (1.86MB)
Semiconductor Packaging Products
Thermal grease is a thermally conductive silicone paste acting as a medium between heat sinks and microprocessors. With its high thermal conductivity values, thermal grease is ideal for use as the primary thermal interface material (TIM 1 and TIM 2) for CPUs, MPUs and GPUs. G765 has a high insulation thermal resistance, while the other compounds were formulated to emphasize thermal conductivity X23-7762 and X23-7783D product offerings were formulated emphasize high bulk thermal conductivity values and ease of workability.
Shrinking die and increasing power demands continue to make thermal conductive compounds a critical part of IC package design. The use of silicone gel is necessary for proper heat dissipation, to improve performance and reliability of devices by enabling packages to run cooler. Shin-Etsu’s thermal gel enables users to reduce the overall cost of their thermal solution.
Shin-Etsu Chemical’s High Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics.
As demands for faster electronic devices increase, typically so does the amount of heat generated, requiring the need for higher degree of silicone hardness. If heat cannot escape efficiently, the performance of the device tends to degrade. That is why Shin-Etsu Chemical’s thermal interface, high hardness materials are consistently utilized in the electronics industry and are considered an important tool in meeting higher performance targets for next generation devices.
Shin-Etsu Chemical’s Low Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics.
As demands for faster electronic devices increase, typically so does the amount of heat generated. If heat can not escape efficiently, the performance of the device tends to suffer. That is why Shin-Etsu Chemical’s thermal interface materials are consistently utilized in the electronics industry and are considered an important tool in meeting higher performance targets for next generation devices.
Shin-Etsu Chemical’s thermally conductive phase change thermal pad utilizes phase change material that offers superior cooling solutions for increased thermal management. The PCS series phase change thermal pad is designed to achieve low contact resistance with a thin bond line thickness. Shin-Etsu Chemical’s phase change material is consistently utilized in the electronics industry and is considered an important tool in meeting higher performance thermal targets for next generation devices. This phase change thermal pad, made up of silicone rubber thermal interface materials, contains a high percentage of thermally conductive fillers to dissipate heat, while utilizing an optimal softening temperature. Shin-Etsu Chemical’s phase change material exhibits outstanding thermal performance and stability when filling the gap between the heat-generating device and its corresponding heat sink.
Shin-Etsu Chemical’s TC-SAS thermal conductive tape is a non-acryl based, adhesive, double sided thermal tape that offers superior thermal conductivity, peeling and high adhesion strength properties. Additional advantages of the TC-SAS thermal conductive tape is the excellent electrical isolation features and easy to apply and remove for rework.
The products in our electrically conductive materials series have the superior qualities of silicone rubber, plus electrical conductivity thanks to the addition of carbon and other conductive materials. They are available in many forms, including sheets, tapes, O-rings and other desired shapes; and are ideal for electromagnetic shielding for office equipment and medical equipment, and as antistatic rubber for electric and electronic equipment.
Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of silicone molding compounds and epoxy molding compounds that offer low stress, very low warpage, and high thermal conductivity.
Our ionic, high purity, electronic grade silicone encapsulant is made with encapsulant material and resins used to protect semiconductor elements and electronics parts both magnetically and mechanically. Shin-Etsu MicroSi offers a full line of Junction Coating Resins. These high purity silicone-based polymers provide outstanding electrical, mechanical and thermal stability and excellent adhesive strength for junction coating applications
Shin-Etsu Chemical Company is the preeminent supplier of high purity silicones to the semiconductor industry and a leader in silicone LED packaging solutions. High purity silicones have been selected to create LED encapsulants because of their high reliability under qualification stresses. Shin-Etsu MicroSi’s LED encapsulant products are non-yellowing, crack resistant, and optically clear even after exposure to harsh conditions.
Shin-Etsu manufactures a broad range of photoimageable dielectric materials for advanced packaging applications, wafer-level packaging, and 3D integration. These include photosensitive dielectric materials for redistribution wiring (RDL) and stress buffer applications, TSV filling, and permanent wafer bonding. Also, dielectric materials for D2D (die-to-die) and D2W (die-to-wafer) bonding, as well as wafer-level overmolding, temporary bonding materials that enable wafer thinning, and photoresists for copper pillar plating and other micro-interconnects.
Silicone interposers are an excellent way to isolate silicon layers and provide spacing for stacked dies applications. The benefits of interposers can be realized while using standard manufacturing equipment, such as die sawing and bonding machines. Therefore, capital expenditures are kept to a minimum when using interposers as part of an efficient manufacturing process. The basic structure of the silicone interposer includes a blank wafer coated with a thin layer of polymer adhesive on each side. Unique polyamide hybrid and silicone formulations of polymer adhesive are available. Shin-Etsu’s low stress, high adhesion technology allows the interposers to be used in lead free low K applications. Total thickness of the interposers can be a thin as 100mm.
Adhesive MaterialRead more
Die BandRead more
Phosphor Binder Buffer LayerRead more
Silicone LensRead more
Thermal Grease G751Read more
Thermal Grease G765Read more
Thermal Grease X23-7762Read more
Thermal Grease X23-7783DRead more
Thermal Grease X23-7868-2DRead more
Thermal Grease X23-7869-2DRead more