Packaging

The Shin-Etsu Group, utilizing resources from multiple divisions, offers an extensive product line of traditional packaging materials and materials for advanced packaging; including 2.5D and 3D. Shin-Etsu MicroSi is the leader in Thermal Interface Material, and we have developed an extensive line of Molding Compounds, Encapsulents, Silicon and Epoxy coatings along with die Attachment Materials. The quality of our thermal interface material is among the most advanced in semiconductor manufacturing and has a wide range of use in thermal interface material applications. Some of which include thermal gels and grease, phase change materials, and high hardness silicone rubber pads. Shin-Etsu’s line of 2.5D and 3D packaging material Shin-Etsu provides is delivered globally to many major and minor companies involved in the fabrication process of electronics and microelectronics.

Semiconductor Packaging Products

Thermal Grease
Thermal Gel
Pads & Phase Change Material

High Hardness Thermal Interface Silicone Rubber Pad Materials
Low Hardness Thermal Interface Silicone Rubber Pad Materials
Phase Change Material (PCM)
Double-sided tape
Electrically Conductive

Molding Compounds
Encapsulants & Underfills
LED Encapsulant Material
Interposers
Inter-Connectors
Advanced Packaging Materials

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