Encapsulants & Underfills

EncapsulantsandUnderfills
Our ionic, high purity, electronic grade silicone encapsulant is made with encapsulant material and resins used to protect semiconductor elements and electronics parts both magnetically and mechanically. Shin-Etsu MicroSi offers a full line of Junction Coating Resins. These high purity silicone-based polymers provide outstanding electrical, mechanical and thermal stability and excellent adhesive strength for junction coating applications

KJR Series

Typical applications for Shin-Etsu KJR Series products are depicted below:

A. GTO Thyristor CoatingGTOThyristorCoating B. Hybrid IC Chip CoatingHybridICChipCoating
C. Thermal Head CoatingThermalHeadCoating D. Photo Diode CoatingPhotoDiodeCoating
E.LCD Electrode Protection CoatingLCDElectrodeProtection F. Other Optical devices-Controlled Refractive Index
High Transparency
None yellowing after stress test

IonicImpurities

The KJR Series offers very low Ionic impurities. These products are extremely pure, providing superior stability to all types of semiconductor devices. The most critical impurity, chloride ion, is kept to an absolute minimum, greatly reducing the risk of electrode corrosion.

Shin-Etsu KJR silicone encapsulant series can be classified into three categories according to the chemical curing mechanism used. The manufacturing process and or the specific characteristics of the device may dictate which product group will best fit your requirement.

Rigid: After curing, the coating of the encapsulant material hardens to a highly rigid polyimide. It has excellent adhesive properties and is an ideal coating for particularly high voltage resistant devices.

Flexible: After curing, this coating material has outstanding rubber elastic properties. By absorbing stress due to external forces, it can prevent fracturing of the devices.

Gel: After curing, this coating material is a soft gel type material. It has extremely low stress and provides the maximum buffer effect available. Its superb adhesion strength and lead sealing, it provides the best humidity protection.

The curing conditions for some of the KJR products are listed below:

Product Type Product Type Product Type
Flexible 9051E; 9052E 80~100°C/1~4 hrs
9022E; 9023E; 9050E 100~150°C/1~4 hrs
9033E; 9060E; 9061E 100~150°C/1~4 hrs
4010E; 4013E; 4012E; 4050E 20~25°C/45~65% RHD/24Hr
+150°C/1~4 hrs
Gel 9010E; 9015E 100~150°C/1~4 hrs
9014E; 9017E 150~170°C/1~4 hrs
Rigid 651E;
654E
150°C/1Hr+200°C/1Hr+
250°C/4Hr
653E 150°C/1Hr+200°C/16Hr