Molding Compounds

PRODUCT DESCRIPTION

Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of silicone molding compounds and epoxy molding compounds that offer low stress, very low warpage, and high thermal conductivity.

  • Excellent reliability
  • Ultra low internal stress
  • Low levels of ionics
  • Excellent moldability
  • Nonflammable
  • Low a particle counts
  • o (VA grade)
  • Sb/Br free
  • o (green molding compound)

Shin-Etsu is a world leader in silicone molding compound and epoxy molding compound technology for use in semiconductor packaging. We have nearly fifty years of experience in the field of silicones and are one of the largest manufacturers in the world. Shin-Etsu holds the patent for the basic catalyst for epoxy molding compounds along with the basic patent for silicone softener technology related to epoxy molding compounds. Shin-Etsu is a basic supplier of many of the raw materials used in this product line, including silicone softeners, silicone coupling agents, synthetic silica and aluminum oxide.

In 1991 the Japanese Minister of international trade and industry awarded Shin-Etsu a national invention award for our technology in stress reduction of epoxy resins. Our method of dispersing silicone in our epoxy resin allows us to reduce the number of flexural modulus, maintain excellent heat resistance and a high glass transition temperature, thus reducing total internal stress. As a result of this new technology, the long term reliability of devices encapsulated in semiconductor packaging made with Shin-Etsu epoxy molding compounds and silicone molding compounds has been drastically improved.

LEAD FRAME

LeadFrame

POWER DEVICES

PowerDevices

LAMINATES

Laminates

 

GREEN COMPOUNDS – ANTI POPCORN FOR LEAD FREE SOLDERING

GreenCompounds

TYPICAL PROPERTIES

Unit KMC-184 KMC-260 KMC-288P KMC-289
Spiral Flow cm 77 100 80 100
Gelation Time sec 18 16 15 16
Flexural Strength N/mm2 127 147 147 147
Flexural Modulus N/mm2 11,278 24,026 23,536 23,536
Glass Transition Temp. degreeC 165 170 145 140
Coefficient of Alpha 1 E-5/
degreeC
1.6 0.9 1.0 1.1
thermal expansion
Alpha 2
E-5/
degreeC
7.4 3.5 4.0 4.5