Phase Change Material (PCM)

Phase Change (PCS) Series
Thermal Interface Silicone Rubber

PRODUCT DESCRIPTION

Shin-Etsu Chemical’s thermally conductive phase change thermal pad utilizes phase change material that offers superior cooling solutions for increased thermal management. The PCS series phase change thermal pad is designed to achieve low contact resistance with a thin bond line thickness. Shin-Etsu Chemical’s phase change material is consistently utilized in the electronics industry and is considered an important tool in meeting higher performance thermal targets for next generation devices. This phase change thermal pad, made up of silicone rubber thermal interface materials, contains a high percentage of thermally conductive fillers to dissipate heat, while utilizing an optimal softening temperature. Shin-Etsu Chemical’s phase change material exhibits outstanding thermal performance and stability when filling the gap between the heat-generating device and its corresponding heat sink.

Shin-Etsu Chemical’s PCS-LT series products are currently designed to be used for thermal conductivity and electrical insulation for power transistors, power modules, CPU’s, GPU’s, NorthBridge and other electrical components.

FEATURES

Shin-Etsu PCS Series phase change thermal pad is made of silicone rubber material and offers the following characteristics:

  • Superior long-term reliability and stability.
  • Achieve suitable BLT and low thermal resistance at low pressure
  • Excellent performance on non-uniform substrates, like a multiple chip package
  • Superior resistance to pump-out
  • Easy to bond to substrate and superior re-workability
  • PCS-LT series can work without deterioration in extremely severe condition like 150C/1000hrs because the PCS-LT series is made of silicone rubber phase change material.

TYPICAL PROPERTIES

Phase Change Material (PCM)

Parameter Unit Test M ethod PCS-LT-60 PCS-LT-30E PCS-TC-A
Color Gray Gray Gray
Structure Single Layer Single Layer Release Film
PCM (60μm)
Aluminum film (50μm)
Initial thickness μm Micro-gauge 200 200 110
Thermal Conductivity W /m-K Laser-Flash M ethod 3.8 3.0 4.0
Density g/cm3 JIS K 6249 2.4 2.4 2.5
Thickness after heat/compression μm Micro-gauge 60 30 80
Thermal resistance cm2-K/W Laser-Flash M ethod 0.18 0.11 0.24

HANDLING AND STORAGE PRECAUTIONS

  • Products should be stored in a dry place out of direct sunlight
  • Avoid contact with residual solvents or oils as they may deteriorate the properties of the product.
  • For better results, the substrate surface should be cleaned and dried to remove any dirt, moisture, or oils before application.