Sensor Materials

Shin-Etsu has developed a number of products that are uniquely  suited for MEMS mounted sensors, smaller package devices and high performance integrated devices.  We have separated these products into Sensor Manufacturing and Sensor Packaging & Assembly.

Sensor Materials Line Card

Sensor Manufacturing

Photoresists – Our broadband, I-line and G-line spin on photoresists are formulated to provide high resolution, vertical profiles, outstanding depth of focus, plasma and wet etch resistance, good plating performance and superior adhesion.
Applications –                              

  • CMOS
  • High Energy Implants
  • MEMS
  • GaAs
  • Thin Film Head
  • Bump
  • Other specialty applications

Substrates – Our synthetic quartz wafers and substrates, bonded SOI and other specialty wafers have exceptional properties that meet the requirements of this industry.
Applications – 

  • MEMS
  • RF Devices
  • TFT-LCD

Resins – Our solvent and water based resins are available as binders for conductive inks.

Applications –

  • Gravure
  • Screen Printing
  • Inkjet

 Sensor Packaging & Assembly

Silicones – Our silicone based materials were developed for MEMS mounted sensors, smaller package devices and high performance devices. We offer single component heat cure silicone gel, polyimide silicone, and fluorosilicone materials.

Applications –

  • Die Bonding
  • Electrode Encapsulation and Chip Coating
  • Frame and EMC stress relief

Photoimageable Dielectrics – Our photoimageable dielectrics are key performance materials for advanced packaging applications, wafer-level packaging, and 3D integration. 

Applications –

  • Stress Buffer
  • TSV Filling
  • Permanent Wafer Bonding
  • Redistribution Wiring (RDL)

Resins – Our solvent and water based resins for coatings, adhesives, sealants, and encapsulates offer chemical resistance, toughness, flexibility and flame resistance. We offer Vinyl Chloride Copolymers, Acrylic, Polyurethane and Silicone Hybrids.

Applications –

  • Flexible textile coatings
  • Adhesives
  • Protective coatings and encapsulation