Chaline R170 170S

Thermal Grease G751


G-751 Datasheet

Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s G-751 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of G-751 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s G-751 is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.

Product Description

[table class=”thermal-grease”]

Viscosity (Pascal Second),250 – 400
Volatile Content, < 1.0%
Specific Gravity, 2.5
Thermal Conductivity(W/m °K), 4.5

Sizes Available

[table class=”thermal-grease”]

Syringes:,”0.5 gm, 1.0 gm, 1.5 gm”
Cartridges:,”55 gm, 150 gm, 400 gm”
Storage Conditions:,”60°F to 85°F”
Bulk:,”1.0 Kg”
Custom Sizes Available, “”

Storage Conditions:,”60°F to 85°F”