Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design.
Shin-Etsu MicroSi’s G-765 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of G-765 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s G-765 is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.
Links to Technical Data Sheets