Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design.
Shin-Etsu MicroSi’s G-765 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of G-765 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s G-765 is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.