Chaline R170 170S

Thermal Grease G765

Category:

G765 Datasheet

Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design.

Shin-Etsu MicroSi’s G-765 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of G-765 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s G-765 is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.

Product Description

[table class=”thermal-grease”]
Property,Value

Viscosity (Pascal Second),250
“Appearance”,Gray
Volatile Content, < 1.0%
Specific Gravity, 2.8
Thermal Conductivity(W/m °K), 3.0
[/table]

Sizes Available

[table class=”thermal-grease”]

Container,Weight
Syringes:,”0.35 gm, 1.0 gm”
Cartridges:,”55 gm, 170 gm, 400 gm”
Bulk:,”1.0 Kg”
Custom Sizes Available, “”

Storage Conditions:,”60°F to 85°F”
[/table]