Thermal Grease G765

Chaline R170 170S

Category:

G765 Datasheet

Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design.

Shin-Etsu MicroSi’s G-765 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of G-765 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s G-765 is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.

Product Description

  • Excellent thermal resistance (TR) and thermal conductivity (TC)
  • Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
  • Stable homogeneous mixture for consistent thermal performance
    RoHS and REACH Compliant
  • High volume production product from a proven industry leader Available worldwide through established supply chain networks

 

Material Properties

Property Value
Viscosity @ 25°C (Pascal Second) 250
Appearance “Gray”
Volatile Content after 24hrs. at 150℃ (%) < 1.0%
Specific Gravity 2.8
Thermal Conductivity(W/m °K) 3.0

 

Sizes Available

Container Weight
Syringes: “0.35 gm, 1.0 gm”
Cartridges: “55 gm, 170 gm, 400 gm”
Bulk: “1.0 Kg”
Storage Conditions “60°F to 85°F”
Custom Sizes Available Contact Us