MicroPrime HP Primer (HMDS)

HMDS Package – Shin-Etsu MicroSi

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MicroPrime HP Primer

Product Description

Product Description
MicroPrime HP Primer is a highly purified grade of hexamethyldisilazane (HMDS) produced for semiconductor
process applications.   Shin-Etsu’s adhesion promoters are used to enhance the bonding of photoresist to a silicon dioxide surface.

Product Characteristics

  • Shin-Etsu MicroSi’s MicroPrime™ HP Primer adhesion promoter readily react with the substrate material
    removing water and reducing surface energy.
  • The resulting water repellent hydrophobic interface
    prevents etchants from undercutting the


  • MicroPrime HP Prime reacts readily with silicon oxide surfaces removing adsorbed water and reducing surface silanols, thus preventing future adsorption of water and other polar materials. During this process, small amounts of ammonia are liberated.
  • Photoresists wet HMDS-treated surfaces uniformly. The developers and etchants used in subsequent steps are unable to penetrate the HMDS treated SiO2/resist interface.  This prevents lifting and minimizes undercutting of the resist.

Specification Data

Purity, Min ≥ 99.7%
Residue, Max ≤3.0ppm
Chloride ≤0.5ppm


Attributes Typical Values
Molecular Weight 161.4
Density, 25°C 0.769
Boiling Point 126°C
Flash Point 10°C
Refractive Index 1.4055
UV Absorption max (270nm)  0.25


Typical Elemental Impurities
Ag Silver <5.0 ppb
Al Aluminum <5.0 ppb
As Arsenic <5.0 ppb
Ca Calcium <5.0 ppb
Cr Chromium <5.0 ppb
Cu Copper <5.0 ppb
Fe Iron <5.0 ppb
K Potassium <5.0 ppb
Mg Magnesium <5.0 ppb
Ma Manganese <5.0 ppb
Na Sodium <5.0 ppb
Ni Nickel <5.0 ppb
Pb Lead <5.0 ppb
Sb Antimony <10.0 ppb
Zn Zinc <5.0 ppb


MicroPrime HP Primer can be applied to oxide substrates by several techniques, including vapor prime, spinning and spraying.  Environmentally stable primed substrates with uniform coverage are obtained by treatment in
vapor deposition tracks and ovens (Typical application temperatures are from 100-150°C).  Vapor prime
application offers rapid and uniform reproducible priming of substrates with a minimum quantity of MicroPrime HP Primer.

Spinning is also a common form of application.  A small amount of MicroPrime HP Primer is applied neat to a wafer spun at 3000-5000 rpm.  This is followed by bake at 100-150 °C.


Cautions in Handling

MicroPrime HP Primer can cause severe burns to eyes and irritation of the skin.  In case of contact with the eyes, immediately flush with plenty of water for at least 15 minutes and get prompt medical attention.  In case of skin contact, flush with plenty of water.  The material should be handled in areas with adequate ventilation to avoid excessive exposure to solvent vapors.

MicroPrime HP Primer is not for food or drug use.

MicroPrime HP Primer is a flammable liquid.  Fires may be extinguished with CO2 or foam.

Please refer to Material Safety Data Sheets prior to using MicroPrime HP Primer.