Thermal grease, X23-7911, is a Non-Solvent thermal interface material developed and manufactured by Shin-Etsu Chemical Co., Ltd. Shin-Etsu MicroSi’s X23-7911 exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7911 allows electronic devices to remain cooler and increases their long term reliability. Typical applications include semiconductor devices: power transistors, ICs, CPUs, stacked memory modules or any application that requires a thermal solution.
Links to Technical Data Sheets
X23-7911 TDS (481.63kB)