Thermal Grease X23-7762

Chaline R170 170S

Category:

X23-7762 Datasheet

Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23- 7762 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23- 7762 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X23-7762 is designed to meet current and future thermal management requirements, thus providing dropin solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.

Product Description

  • Excellent thermal resistance (TR) and thermal conductivity (TC)
  • Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
  • Stable homogeneous mixture for consistent thermal performance
    RoHS and REACH Compliant
  • High volume production product from a proven industry leader Available worldwide through established supply chain networks

 

Material Properties

Property Value
Viscosity @ 25°C (Pascal Second) 180
Appearance “Gray”
Volatile Content after 24hrs. at 150℃ (%) < 2.5%
Specific Gravity 2.6
Thermal Conductivity(W/m °K) 6.0

 

Sizes Available

Container Weight
Syringes: “0.5 gm, 1.0 gm”
Bulk: “1.0 Kg”
Storage Conditions “60°F to 85°F”
Custom Sizes Available Contact Us