Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23- 7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23- 7783D to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X23-7783D is designed to meet current and future thermal management requirements, thus providing dropin solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.
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