Shin-Etsu has developed a number of products that are uniquely suited for MEMS mounted sensors, smaller package devices and high performance integrated devices. We have separated these products into Sensor Manufacturing and Sensor Packaging & Assembly.
Sensor Materials Line Card (225.61kB)
Photoresists – Our broadband, I-line and G-line spin on photoresists are formulated to provide high resolution, vertical profiles, outstanding depth of focus, plasma and wet etch resistance, good plating performance and superior adhesion.
- High Energy Implants
- Thin Film Head
- Other specialty applications
Substrates – Our synthetic quartz wafers and substrates, bonded SOI and other specialty wafers have exceptional properties that meet the requirements of this industry.
- RF Devices
Resins – Our solvent and water based resins are available as binders for conductive inks.
- Screen Printing
Sensor Packaging & Assembly:
Silicones – Our silicone based materials were developed for MEMS mounted sensors, smaller package devices and high performance devices. We offer single component heat cure silicone gel, polyimide silicone, and fluorosilicone materials.
- Die Bonding
- Electrode Encapsulation and Chip Coating
- Frame and EMC stress relief
Photoimageable Dielectrics – Our photoimageable dielectrics are key performance materials for advanced packaging applications, wafer-level packaging, and 3D integration.
- Stress Buffer
- TSV Filling
- Permanent Wafer Bonding
- Redistribution Wiring (RDL)
Resins – Our solvent and water based resins for coatings, adhesives, sealants, and encapsulates offer chemical resistance, toughness, flexibility and flame resistance. We offer Vinyl Chloride Copolymers, Acrylic, Polyurethane and Silicone Hybrids.
- Flexible textile coatings
- Protective coatings and encapsulation