Semiconductor silicon, which includes optically clear encapsulants and thermally conductive encapsulants and adhesives, is regularly used by businesses not only in the semiconductor manufacturing industry, but in a wide variety of other industries as well. These silicones are generally used for LED purposes, providing improved light performance and extended product life.
While using silicones improves the overall performance of numerous LED applications, they can be a little challenging to work with. LED, like other lighting applications, requires very tight control of the color output of light, which can be difficult to produce consistently. Additionally, while LEDs produce cold light at the front of the light source as opposed to hot, they still do create heat in the back of the diode. It is crucial for this heat to escape from the diode as performance levels will quickly weaken under the stress of high temperatures.
In order to avoid any issues with semiconductor silicon for LED, it is important that businesses have the following measures in place:
- Strong thermal designs that allow for maintenance of the appropriate operating temperature at all times
- Well-designed optical systems to ensure that the maximum amount of light is transmitted in a direction opposite of the diode
Thermal and optical systems designed by talented LED engineers are key to the success of LED in devices across a range of industries. In addition to properly working systems, it is also essential that silicone encapsulants be used to protect LED from environmental hazards, such as moisture. These semiconductor silicon encapsulants protect LEDs on both the micro and macro levels, and work to improve the efficiency and performance of the application.
At the micro level, the semiconductor silicon encapsulates the diode of the device, allowing for major improvements to performance. The silicones used must have a low ionic content to lessen the risk of interference with electrical properties from the diode as well as UV resistance, low modulus properties and high coefficient of thermal expansion to avoid significant stress to wire connectivity.
At the macro level, the semiconductor silicon is used to add protection to the final device. Encapsulants or barrier coat products are placed as a protective seal to keep moisture out, and protect from outside environmental forces, such as heat and vibration. Depending on the device, engineers can change the formula of silicones, such as encapsulants and barrier coat products, to meet the specific needs of the product, both pre and post production.
If you are interested in semiconductor silicon, such as silicon encapsulants or adhesives, Shin-Etsu MicroSi, one of the largest semiconductor manufacturers in the world, would be more than happy to help. At Shin-Etsu Phoenix, we have developed a strong line of materials for encapsulating a wide variety of semiconductor devices that offer high reliability, low stress and high thermal conductivity. To learn more about silicones for use in your operations, call Shin-Etsu MicroSi today at (480) 893-8898 or contact us online.