5G & Automotive
The Shin-Etsu Group, utilizing resources from multiple divisions, offers an extensive product line of traditional packaging materials and materials for advanced packaging; including 2.5D and 3D. Shin-Etsu MicroSi is the leader in Thermal Interface Material, and we have developed an extensive line of Molding Compounds, Encapsulents, Silicon and Epoxy coatings along with die Attachment Materials.
Semiconductor Packaging Products:
Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of silicone molding compounds and epoxy molding compounds that offer low stress, very low warpage, and high thermal conductivity.
Our ionic, high purity, electronic grade silicone encapsulant is made with encapsulant material and resins used to protect semiconductor elements and electronics parts both magnetically and mechanically. Shin-Etsu MicroSi offers a full line of Junction Coating Resins. These high purity silicone-based polymers provide outstanding electrical, mechanical and thermal stability and excellent adhesive strength for junction coating applications
Shin-Etsu Chemical Company is the preeminent supplier of high purity silicones to the semiconductor industry and a leader in silicone LED packaging solutions. High purity silicones have been selected to create LED encapsulants because of their high reliability under qualification stresses. Shin-Etsu MicroSi’s LED encapsulant products are non-yellowing, crack resistant, and optically clear even after exposure to harsh conditions.