Molding Compounds

Shin-Etsu is a leader in developing advanced, semiconductor packaging materials for encapsulating all types of semiconductor devices. This broad line of products is made of silicone molding compounds and epoxy molding compounds that offer low stress, very low warpage, and high thermal conductivity.

  • Excellent reliability
  • Ultra low internal stress
  • Low levels of ionics
  • Excellent moldability
  • Nonflammable
  • Low a particle counts
  • o (VA grade)
  • Sb/Br free
  • o (green molding compound)

Shin-Etsu is a world leader in silicone molding compound and epoxy molding compound technology for use in semiconductor packaging. We have nearly fifty years of experience in the field of silicones and are one of the largest manufacturers in the world. Shin-Etsu holds the patent for the basic catalyst for epoxy molding compounds along with the basic patent for silicone softener technology related to epoxy molding compounds. Shin-Etsu is a basic supplier of many of the raw materials used in this product line, including silicone softeners, silicone coupling agents, synthetic silica and aluminum oxide.

In 1991 the Japanese Minister of international trade and industry awarded Shin-Etsu a national invention award for our technology in stress reduction of epoxy resins. Our method of dispersing silicone in our epoxy resin allows us to reduce the number of flexural modulus, maintain excellent heat resistance and a high glass transition temperature, thus reducing total internal stress. As a result of this new technology, the long term reliability of devices encapsulated in semiconductor packaging made with Shin-Etsu epoxy molding compounds and silicone molding compounds has been drastically improved.

LEAD FRAME

Lead Frame Graph - Shin-Etsu MicroSi

POWER DEVICES

Power Devices - Shin-Etsu MicroSi

LAMINATES

Low Wattage and Low Viscosity Laminates - Shin-Etsu MicroSI

GREEN COMPOUNDS - ANTI POPCORN FOR LEAD FREE SOLDERING

Green Compounds - Shin-Etsu MicroSi

TYPICAL PROPERTIES

 UnitKMC-184KMC-260KMC-288PKMC-289
Spiral Flowcm7710080100
Gelation Timesec18161516
Flexural StrengthN/mm2127147147147
Flexural ModulusN/mm211,27824,02623,53623,536
Glass Transition Temp.degreeC165170145140
Coefficient of Alpha 1E-5/
degreeC
1.60.91.01.1
thermal expansion
Alpha 2
E-5/
degreeC
7.43.54.04.5