Adhesion Promotors

Our HMDS and HMDS with DEATS adhesion promoters are used to enhance the bonding of photoresist to a wafer substrate surface. Shin-Etsu MicroSi’s MicroPrime™ adhesion promoter line readily reacts with the substrate material removing adsorbed water and reducing surface energy.

The water repellent hydrophobic interface resulting from the adhesion promoter prevents etchants from undercutting the photoresist.

Specialty Adhesion Promoters:

To enhance the effectiveness of thickfilm photoresist to copper and gold surfaces Shin-Etsu MicroSi offers two specialty adhesion promoters.

  • 100% (HMDS)
  • Highly purified grade of hexamethyldisilazane (HMDS) manufactured specifically for semiconductor applications

MicroPrime MP-90

  • 99.0% HMDS
  • <1.0% DEATS

HMDS modified specifically for vapor track priming in the highly automated semiconductor lithography process. These products provide an increased contact angle that can improve adhesion characteristics on difficult substrates. An increase in the reaction mechanism provides a shorter prime dwell cycle, thereby improving throughput.

MicroPrime MP-95

  • 99.5% HMDS
  • <0.5% DEATS