Adhesion Promotors

Our DEATS and HMDS adhesion promoter is used to enhance the bonding of photoresist to a silicon dioxide surface. Shin-Etsu MicroSi’s MicroPrime™ DEATS and HMDS adhesion promoter line readily reacts with the substrate material removing absorbed water and reducing surface energy. The water repellent hydrophobic interface resulting from the adhesion promoter prevents etchants from undercutting the photoresist.

Shin-Etsu MicroSi has developed two MicroPrime™ product lines for the semiconductor industry. The first is an HMDS primer (hexamethyldisilazane). This chemical is used to promote better adhesion. Using an HMDS primer has certain time advantages over other chemicals. The other is N-diethylaminotrimethylsilane (DEATS). Each adhesion promoter has different advantages, but both of them are equally effective.

Specialty Adhesion Promoters:

To enhance the effectiveness of thickfilm photoresist to copper and gold surfaces Shin-Etsu MicroSi offers two specialty adhesion promoters.

Selection Guide:

  • Adhesion Promoter
  • Product Composition
  • Application

MicroPrime HP Primer

  • 100% (HMDS)
  • Highly purified grade of hexamethyldisilazane (HMDS) manufactured specifically for semiconductor applications

MicroPrime MP-90

  • 99.0% HMDS
  • <1.0% DEATS

HMDS modified specifically for vapor track priming in the highly automated semiconductor lithography process. These products provide an increased contact angle that can improve adhesion characteristics on difficult substrates. An increase in the reaction mechanism provides a shorter prime dwell cycle, thereby improving throughput.

MicroPrime MP-95

  • 99.5% HMDS
  • <0.5% DEATS