Sensor Materials

Shin-Etsu has developed a number of products that are uniquely  suited for MEMS mounted sensors, smaller package devices and high performance integrated devices.  We have separated these products into Sensor Manufacturing and Sensor Packaging & Assembly.

Sensor Manufacturing:

Photoresists – Our broadband, I-line and G-line spin on photoresists are formulated to provide high resolution, vertical profiles, outstanding depth of focus, plasma and wet etch resistance, good plating performance and superior adhesion.

  • CMOS
  • High Energy Implants
  • MEMS
  • GaAs
  • Thin Film Head
  • Bump
  • Other specialty applications

Substrates – Our synthetic quartz wafers and substrates, bonded SOI and other specialty wafers have exceptional properties that meet the requirements of this industry.

  • MEMS
  • RF Devices

Resins – Our solvent and water based resins are available as binders for conductive inks.


  • Gravure
  • Screen Printing
  • Inkjet

Sensor Packaging & Assembly

Silicones – Our silicone based materials were developed for MEMS mounted sensors, smaller package devices and high performance devices. We offer single component heat cure silicone gel, polyimide silicone, and fluorosilicone materials.


  • Die Bonding
  • Electrode Encapsulation and Chip Coating
  • Frame and EMC stress relief

Photoimageable Dielectrics – Our photoimageable dielectrics are key performance materials for advanced packaging applications, wafer-level packaging, and 3D integration. 



  • Stress Buffer
  • TSV Filling
  • Permanent Wafer Bonding
  • Redistribution Wiring (RDL)

Resins – Our solvent and water based resins for coatings, adhesives, sealants, and encapsulates offer chemical resistance, toughness, flexibility and flame resistance. We offer Vinyl Chloride Copolymers, Acrylic, Polyurethane and Silicone Hybrids.



  • Flexible textile coatings
  • Adhesives
  • Protective coatings and encapsulation