High Hardness Thermal Interface Silicone Rubber Pad Materials

Shin-Etsu Chemical’s High Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics.

As demands for faster electronic devices increase, typically so does the amount of heat generated, requiring the need for higher degree of silicone hardness. If heat cannot escape efficiently, the performance of the device tends to degrade. That is why Shin-Etsu Chemical’s thermal interface, high hardness materials are consistently utilized in the electronics industry and are considered an important tool in meeting higher performance targets for next generation devices.

Features

Shin-Etsu Chemical’s High Hardness TC Pad Series Offers the following characteristics:

Typical Properties

ParameterUnitTest MethodTC-CGTC-BG
20CG30CG45CG80CG20BG30BG45BG80BG
ColorLight reddish BrownW hite
Thicknessmm0.200.300.450.800.200.300.450.80
Thermal ConductivityW /m-KISO-22007-21.77.3
Reinforced layerFiberglassFiberglass
Densityg/cm3JIS K 62492.51.5
HardnessDurometer AJIS K 62499090
Tensile StrengthMPaJIS K 624925.924.120.49.351.049.014.0
Tear StrengthkN/mJIS K 62497081702419722320954
Elongation%
Dielectric Breakdown VoltagekVJIS K 62495710197121621
Dielectric StrengthkVJIS C 21102351025712
Volume ResistivityTΩ-mJIS K 62491.81.21.0810911
Dielectric Constant50HzJIS K 62493.84.24.33.03.12.9
1kHz3.84.24.33.03.12.9
1MHz3.84.24.33.03.12.9
Dielectric Dissipation Factor50HzJIS K 62497×10-36×10-35×10-33×10-35×10-39×10-3
1kHz4×10-33×10-32×10-35×10-3
1MHz4×10-33×10-32×10-3
Thermal Resistance with TO-3P transistor°C/WShin-Etsu Method0.480.701.001.300.110.260.350.46
Flame-RetardanceUL-94V-0V-0
Low-molecular weight siloxane contentppmShin-Etsu Method10>(ΣD3-10)10>(ΣD3-10)
Stock SizeSheetmm320×1000300×1000210x270
Roll

Handling and Storage Precautions