Low Hardness Thermal Interface Silicone Rubber Pad Materials

Shin-Etsu Chemical’s Low Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics.

As demands for faster electronic devices increase, typically so does the amount of heat generated. If heat can not escape efficiently, the performance of the device tends to suffer. That is why Shin-Etsu Chemical’s thermal interface materials are consistently utilized in the electronics industry and are considered an important tool in meeting higher performance targets for next generation devices.

Features

Shin-Etsu Chemical’s Low Hardness TC Pad Series Offers the following characteristics:

Typical Properties

ParameterUnitTest MethodTC-SP-1.7TC-SPA-3.0TC-HSV-1.4TC-CAS-5TC-CAS-10
ColorGray/Reddish brownGrayGrayGrayGray
Sheet Sizemm300×400300×400300×400300×400300×400
StructureCompositeSingle layerSingle layerSingle layerSingle layer
Thicknessmm0.5 – 5.00.5 – 3.00.5 – 3.00.5 – 3.00.5 – 3.0
Densityg/cm3JIS K 62492.32.42.51.91.9
HardnessAsker C2425510
Dielectric Breakdown Voltage @ 1mmkVJIS K 6249200.24232222
Thermal ConductivityW /m-KISO-22007-21.52.31.21.81.8
Thermal Resistance @ 1mm°C/WShin-Etsu Method1.000.421.080.630.65
Flame-RetardanceUL-94V-0V-0V-0 (Shin-Etsu test)
Low-molecular weight siloxane contentppmShin-Etsu Method200 (ΣD3-10)260 (ΣD3-10)TBD (ca. 200 (ΣD3-10))
ParameterUnitTest MethodTC-CAB-5TC-CAB-10TC-CAD-5TC-CAD-10TC-CAT-10TC-CAT-20
ColorPinkPinkLight Red/PurpleLight Red/PurpleGrayGray
Sheet Sizemm300×400300×400300×400300×400300×400300×400
StructureSingle layerSingle layerSingle layerSingle layerSingle layerSingle layer
Thicknessmm0.5 – 3.00.5 – 3.00.5 – 3.00.5 – 3.00.5 – 3.00.5 – 3.0
Densityg/cm3JIS K 62492.22.23.03.03.23.2
HardnessAsker C5105101020
Dielectric Breakdown Voltage @ 1mmkVJIS K 6249222215151515
Thermal ConductivityW /m-KISO-22007-22.32.33.23.24.54.5
Thermal Resistance @ 1mm  0.470.490.410.430.300.32
   V-0 (Shin-Etsu test)
   TBD (ca. 200 (ΣD3-10)

Handling and Storage Precautions