Two Part Curable Gap Fillers

Shin-Etsu’s two-part Gap Fillers are silicone materials with fillers that provide high thermal conductivity while maintaining electrical isolation. The main application for these Thermal Interface Materials is to fill gaps between components and heat sinks. Applied in liquid form, they produce less stress on components during assembly. The material cures in place and remains a soft elastomer.  Shin-Etsu’s two-part Gap Fillers can be used on a larger range of gap thicknesses.  The liquid material can be applied in different thicknesses in adjacent areas to account for varied interface topography.  They provide a natural tack between mating surfaces but do not create a structurally adhesive connection.

Product Features:

Two Part Curable Gap Filler

ItemMain FillerAppearanceViscosity (Pa•s)Thermal conductivity (W/m•°K)Specific GravityCuring conditionHardness (Asker C)Elongation (%)Tensile strength (MPa)Dielectric strength
(kV/mm)
Volume resistivity (Ω•m)Bond Line Thickness (µm)
X23-8039-A/BThermal Resistance (mm2-K/W) Al2O3 InsulationThermal Resistance (mm2-K/W) White/ Sky BlueViscosity (Pa•s) A:102/B:55Thermal conductivity (W/m•°K) 1.1Specific Gravity 2.5Curing condition 25° C × 24hrsHardness (Asker C) 10Elongation (%) 480Tensile strength (MPa) 0.3Dielectric strength
(kV/mm)
19
Volume resistivity (Ω•m) 2.3×10^12Bond Line Thickness (µm) 12
X23-8043-A/BAl2O3 InsulationWhite/ Sky BlueViscosity (Pa•s) A:99/B:71Thermal conductivity (W/m•°K) 2.3Specific Gravity 2.9Curing condition 25° C × 24hrsHardness (Asker C) 25Elongation (%) 70Tensile strength (MPa) 0.3Dielectric strength
(kV/mm)
18
Volume resistivity (Ω•m) 2.3×10^12Bond Line Thickness (µm) 120
X23-8051-A/BAl2O3 InsulationWhite/ GrayViscosity (Pa•s) A:103/B:72Thermal conductivity (W/m•°K) 3.5Specific Gravity 3.1Curing condition 25° C × 24hrsHardness (Asker C) 17Elongation (%) 40Tensile strength (MPa) 0.1Dielectric strength
(kV/mm)
20
Volume resistivity (Ω•m) 2.3×10^12Bond Line Thickness (µm) 120
X23-8068 A/BAl2O3 InsulationGrayish White/PinkViscosity (Pa•s) A:181 / B:162Thermal conductivity (W/m•°K) 5.1Specific Gravity 3.3Curing condition 25° C × 24hrsHardness (Asker C) 16Elongation (%) 30Tensile strength (MPa) 0.1Dielectric strength
(kV/mm)
21
Volume resistivity (Ω•m) 2.3×10^12Bond Line Thickness (µm) 120
X23-8098 A/BAl2O3 InsulationGrayish White/PinkViscosity (Pa•s) A:282 / B:288Thermal conductivity (W/m•°K) 6.5Specific Gravity 3.2Curing condition 25° C × 24hrsHardness (Asker C) 30Elongation (%) 20Tensile strength (MPa) 0.1Dielectric strength
(kV/mm)
20
Volume resistivity (Ω•m) 2.3×10^12Bond Line Thickness (µm) -