hrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X-23- 7772-4 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X-23- 7772-4 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X-23-7772-4 is designed to meet current and future thermal management requirements, thus providing dropin solutions for new IC packages, without the expense of qualifications. This highly thermal conductive gel has been successfully used throughout the semiconductor industry on temperature sensitive components.