Thermal Grease (Thermally Conductive Silicone Paste)
Thermal grease is a thermally conductive silicone paste acting as a medium between heat sinks and microprocessors. With its high thermal conductivity values, thermal grease is ideal for use as the primary thermal interface material (TIM 1 and TIM 2) for CPUs, MPUs and GPUs. G765 has a high insulation thermal resistance, while the other compounds were formulated to emphasize thermal conductivity X23-7762 and X23-7783D product offerings were formulated emphasize high bulk thermal conductivity values and ease of workability.
Grease Selection Chart
As developers continue to create microprocessors that are smaller, faster and hotter than their predecessors, the ability to dissipate the heat generated by these devices and increase thermal resistance for others is critical to the overall performance and longevity of the platforms that incorporate them. Shin-Etsu MicroSi is committed to meet these needs by manufacturing quality thermal grease and a wide variety of other thermally conductive products.
Shin-Etsu Chemical has developed an extensive range of thermal solutions, and is the recognized as the world leader in thermal interface material (TIM) applications.
|Item||Appearance||Main Filler||Viscosity (Pa•s)||Specific Gravity||Thermal conductivity (W/m•°C)||BLT (µm)||Thermal Resistance (mm2-K/W)|
|G751||Appearance Gray||Main Filler Al||Viscosity (Pa•s) 400||Specific Gravity 2.5||Thermal conductivity (W/m•°C) 4.7||BLT (µm) 73||Thermal Resistance (mm2-K/W) 17|
|G765||Appearance Gray||Main Filler Al||Viscosity (Pa•s) 250||Specific Gravity 2.8||Thermal conductivity (W/m•°C) 3||BLT (µm) -||Thermal Resistance (mm2-K/W) -|
|X23-7762||Appearance Gray||Main Filler Al||Viscosity (Pa•s) 140||Specific Gravity 2.6||Thermal conductivity (W/m•°C) 4.0 (w/ solvent)|
6.5 (w/out solvent)
|BLT (µm) 72||Thermal Resistance (mm2-K/W) 12.8|
|X23-7783D||Appearance Gray||Main Filler Al||Viscosity (Pa•s) 170||Specific Gravity 2.6||Thermal conductivity (W/m•°C) 3.5 (w/ solvent)|
5.7 (w/out solvent)
|BLT (µm) 38||Thermal Resistance (mm2-K/W) 7.3|
|X23-7868-2D||Appearance Gray||Main Filler Al||Viscosity (Pa•s) 100||Specific Gravity 2.7||Thermal conductivity (W/m•°C) 3.5 (w/ solvent)|
6.2 (w/out solvent)
|BLT (µm) 30||Thermal Resistance (mm2-K/W) 4.9|
|X23-7921-5||Appearance Gray||Main Filler Al||Viscosity (Pa•s) 360||Specific Gravity 2.6||Thermal conductivity (W/m•°C) 6.0||BLT (µm) 25||Thermal Resistance (mm2-K/W) 5.0|
|X23-8079-2||Appearance Gray||Main Filler Al||Viscosity (Pa•s) 150||Specific Gravity 2.6||Thermal conductivity (W/m•°C) 5.4||BLT (µm) 23||Thermal Resistance (mm2-K/W) 5.8|
|X23-8117||Appearance Gray||Main Filler Al||Viscosity (Pa•s) 80 (with solvent)|
700 (w/o solvent)
|Specific Gravity 2.6||Thermal conductivity (W/m•°C) 3.5 (w/ solvent)|
6.0 (w/out solvent)
|BLT (µm) 26||Thermal Resistance (mm2-K/W) 6.1|
Shin-Etsu MicroSi’s thermally conductive silicone paste and thermal interface material is available in several cost effective packages which include syringes, cartridges and bulk containers.
Shin-Etsu MicroSi’s thermal grease syringes are ideal for manual applications. Pre-filled syringes assure that a consistent shot weight is applied to the intended surface. Shin-Etsu MicroSi’s SQC processes provide a consistent dispense weight of thermal grease with each syringe. The Syringe Delivery Method provides the most flexibility for an organization, with the ability to utilize the same product package for production and field requirements without additional investment in application tools.
Bulk delivery provides the lowest possible unit cost. Bulk purchases of thermal grease and other products with thermal conductivity and thermal resistance are available for large scale production facilities where material is consumed at a rapid rate.