The New Semiconductor Service Model

Semiconductor devices have allowed society to take advantage of a wide range of technical products that make everyday life easier and more enjoyable. Without semiconductor devices, products in industries, such as data processing, communications, electronics and automotive, would not be nearly as advanced as they are today.

The semiconductor manufacturing industry is well aware of how important semiconductor devices are to a wide variety of industries that people around the world depend on. The innovative spirit of the semiconductor industry has led to regular and rapid improvements to chips, which have continuously decreased in size year after year. While these innovations have provided major technological advances for products in industries across the board, the road to improvement has never been an easy one.

One of the major struggles that the semiconductor manufacturing industry faces is how to adjust their processes for each new generation of chips. With every new design, the yield of chips begins very poorly until the semiconductor industry is able to figure out all the kinks in production. Throughout the years, the semiconductor industry has had to come up with innovative solutions in order to avoid errors in chip production and produce the highest yields possible.

The following is a list of the three semiconductor repair services the semiconductor manufacturing industry has implemented over time to keep up with the changing technologies:

  • Service Part 1 – Back in the day, chips had a more simple design that required less complex semiconductor manufacturing machines. These machines were responsible for moving chips through only 30 or more steps, which is very low when compared to the chips of today. Due to the simplicity of the chips, the semiconductor manufacturing machines could easily be fixed by a technician when they malfunctioned.
  • Service Part 2 – When chips started to become more complex, this semiconductor manufacturing service model came about to gain a better handle on the technology. Chips in the semiconductor industry now required millions of transistors and wiring to be packed into the area of a small chip, meaning that the service model had to evolve. While this model addressed the repair of equipment, like with Service 1.0, it also aimed to improve the process with higher yields and lower costs.
  • Service Part 3 – Chips in today’s semiconductor manufacturing industry have reached a level that the industry once thought to be impossible. There are now billions of transistors packed into tiny chips with various designs and materials. As opposed to the thirty or so steps once required to produce a chip, the semiconductor manufacturing industry now produces highly complex chips that require hundreds of machines to complete over a thousand steps. This means that the chances of error are high, so it is essential that the processes be very closely monitored. This model thoroughly examines every piece of data in the fab to not only identify areas that are leading to poor chip performance, but also to predict these areas before they become a problem.

As a business in the semiconductor manufacturing industry, it is important to stay on top of the changes in technology in order to produce the largest output of high quality semiconductor devices. Implementing the latest service model, Service 3.0, will help you to achieve this goal.

If you are interested in further improving your semiconductor manufacturing processes, trust in the experts at Shin-Etsu MicroSi. As a leader in research, development and manufacturing for the semiconductor industry, we are always on the cusp of technology for semiconductor devices. For more information on our products and services, please call Shin-Etsu MicroSi at (480) 893-8898 or contact us online.

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